ISL97692, ISL97693, ISL97694A

10

FN7839.5

May 1, 2014

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Ordering Information

PART NUMBER

(Notes 1, 4)

PART

MARKING

TEMP RANGE

(°C)

PACKAGE

(Pb-free)

PKG.

DWG. #

ISL97692IRTZ (Note 2)

7692

-40 to +85

16 Ld 3x3x0.75mm TQFN

L16.3x3D

ISL97692IIZ-T (Note 3)

7692

-40 to +85

16 Bump 1.7x1.7mm, 0.4mm Pitch WLCSP

W4x4.16B

ISL97693IRTZ (Note 2)

7693

-40 to +85

16 Ld 3x3x0.75mm TQFN

L16.3x3D

ISL97694AIRTZ (Note 2)

694A

-40 to +85

20 Ld 3x4x0.8mm TQFN

L20.3x4A

ISL97692IRTZ-EVALZ

Evaluation board for TQFN

ISL97692IIZ-EVZ

Evaluation board for WLCSP

ISL97693IRTZ-EVALZ

Evaluation board for TQFN

ISL97694AIRT-EVZ

Evaluation board for TQFN

NOTES:

1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.

2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte

tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil

Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

3. These Intersil Pb-free WLCSP and BGA packaged products employ special Pb-free material sets; molding compounds/die attach materials and

SnAgCu - e1 solder ball terminals, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free

WLCSP and BGA packaged products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/

JEDEC J STD-020.

4. For Moisture Sensitivity Level (MSL), please see device information page for ISL97692, ISL97693, ISL97694A. For more information on MSL please

see tech brief TB363.