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MIC5236-3.0BMM Datasheet(PDF) 11 Page - Micrel Semiconductor |
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MIC5236-3.0BMM Datasheet(HTML) 11 Page - Micrel Semiconductor |
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11 / 12 page  November 2000 11 MIC5236 MIC5236 Micrel amount of copper can be determined by knowing the maxi- mum power dissipation required. If the maximum ambient temperature is 50 °C and the power dissipation is as above, 632mW, the curve in Figure 7 shows that the required area of copper is 25mm2. The θ JA of this package is ideally 63°C/W, but it will vary depending upon the availability of copper ground plane to which it is attached. 0 100 200 300 400 500 600 700 800 900 0 0.25 0.50 0.75 1.00 1.25 1.50 POWER DISSIPATION (W) 85 °C 50 °C 25°C T J = 125 °C Figure 7. Copper Area vs. Power-SOP Power Dissipation (T A) 0 100 200 300 400 500 600 700 800 900 0 0.25 0.50 0.75 1.00 1.25 1.50 POWER DISSIPATION (W) Figure 8. Copper Area vs. Power-MSOP Power Dissipation (∆T JA) The same method of determining the heat sink area used for the power-SOP-8 can be applied directly to the power- MSOP-8. The same two curves showing power dissipation versus copper area are reproduced for the power-MSOP-8 and they can be applied identically, see Figures 8 and 9. 0 100 200 300 400 500 600 700 800 900 0 0.25 0.50 0.75 1.00 1.25 1.50 POWER DISSIPATION (W) 85 °C 50 °C 25°C T J = 125 °C Figure 9. Copper Area vs. Power-MSOP Power Dissipation (T A) Power MSOP-8 Thermal Characteristics The power-MSOP-8 package follows the same idea as the power-SO-8 package, using four ground leads with the die attach paddle to create a single-piece electrical and thermal conductor, reducing thermal resistance and increasing power dissipation capability. Quick Method Determine the power dissipation requirements for the design along with the maximum ambient temperature at which the device will be operated. Refer to Figure 9, which shows safe operating curves for three different ambient temperatures, 25 °C, 50°C, and 85°C. From these curves, the minimum amount of copper can be determined by knowing the maxi- mum power dissipation required. If the maximum ambient temperature is 50 °C, and the power dissipation is 639mW, the curve in Figure 9 shows that the required area of copper is 110mm2,when using the power MSOP-8. |
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