Data Sheet

8

Rev. 1.1, 2015-03-19

TLD1120EL

General Product Characteristics

4

General Product Characteristics

4.1

Absolute Maximum Ratings

Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the

data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are

not designed for continuous repetitive operation.

T

currents flowing out of the I/O and output pins (O) (unless otherwise specified)

1) Not subject to production test, specified by design

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Max.

Voltages

4.1.1

Supply voltage

V

S

-16

40

V

–

4.1.2

Input voltage EN

V

EN

-16

40

V

–

4.1.3

Input voltage EN related to

V

S

V

EN(VS)

V

V

V

–

4.1.4

Input voltage EN related to

V

OUT

V

V

V

OUT

-16

40

V

–

4.1.5

Output voltage

V

OUT

-1

40

V

–

4.1.6

Power stage voltage

V

V

PS

-16

40

V

–

4.1.7

IN_SET voltage

V

IN_SET

-0.3

6

V

–

Currents

4.1.8

IN_SET current

I

IN_SET

–2

mA

–

4.1.9

Output current

I

OUT

–390

mA

–

Temperatures

4.1.10

Junction temperature

T

j

-40

150

°C–

4.1.11

Storage temperature

T

stg

-55

150

°C–

ESD Susceptibility

4.1.12

ESD resistivity to GND

V

ESD

-2

2

kV

Human Body

Model (100 pF via

1.5 k

2) ESD susceptibility, Human Body Model “HBM” according to ANSI/ESDA/JEDEC JS-001-2011

4.1.13

ESD resistivity all pins to GND

V

ESD

-500

500

V

3) ESD susceptibility, Charged Device Model “CDM” according to JESD22-C101E

4.1.14

ESD resistivity corner pins to GND

V

ESD

-750

750

V

CDM3)