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BUK724R5-30C Datasheet(PDF) 3 Page - NXP Semiconductors

Part # BUK724R5-30C
Description  N-channel TrenchMOS standard level FET
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BUK724R5-30C Datasheet(HTML) 3 Page - NXP Semiconductors

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BUK724R5-30C
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 1 July 2010
3 of 14
NXP Semiconductors
BUK724R5-30C
N-channel TrenchMOS standard level FET
4.
Limiting values
[1]
Current is limited by power dissipation chip rating.
[2]
Continuous current is limited by package.
[3]
Single-pulse avalanche rating limited by maximum junction temperature of 175 °C.
[4]
Repetitive avalanche rating limited by average junction temperature of 170 °C.
[5]
Refer to application note AN10273 for further information.
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDS
drain-source voltage
Tj ≥ 25 °C; Tj ≤ 175 °C
--30
V
VDGR
drain-gate voltage
RGS =20kΩ
--30
V
VGS
gate-source voltage
-20
-
20
V
ID
drain current
VGS =10V; Tj =25°C; see Figure 1;
see Figure 4
[1]
-
-
136
A
Tmb =100 °C; VGS = 10 V; see Figure 1 [2]
--75
A
VGS =10V; Tj =25°C; see Figure 1
[2]
--75
A
IDM
peak drain current
tp ≤ 10 µs; pulsed; Tj =25°C;
see Figure 4
-
-
543
A
Ptot
total power dissipation
Tmb =25°C; see Figure 2
-
-
157
W
Tstg
storage temperature
-55
-
175
°C
Tj
junction temperature
-55
-
175
°C
Source-drain diode
IS
source current
Tmb =25°C
[2]
--75
A
[1]
-
-
136
A
ISM
peak source current
tp ≤ 10 µs; pulsed; Tmb = 25 °C
-
-
543
A
Avalanche ruggedness
EDS(AL)S
non-repetitive
drain-source
avalanche energy
ID =75A; Vsup ≤ 30 V; RGS =50 Ω;
VGS =10V; Tj(init) = 25 °C; unclamped
-
-
329
mJ
EDS(AL)R
repetitive drain-source
avalanche energy
see Figure 3
[3][4][5]
---J


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