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BUK724R5-30C Datasheet(PDF) 3 Page - NXP Semiconductors |
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BUK724R5-30C Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 14 page BUK724R5-30C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 1 July 2010 3 of 14 NXP Semiconductors BUK724R5-30C N-channel TrenchMOS standard level FET 4. Limiting values [1] Current is limited by power dissipation chip rating. [2] Continuous current is limited by package. [3] Single-pulse avalanche rating limited by maximum junction temperature of 175 °C. [4] Repetitive avalanche rating limited by average junction temperature of 170 °C. [5] Refer to application note AN10273 for further information. Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Typ Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C --30 V VDGR drain-gate voltage RGS =20kΩ --30 V VGS gate-source voltage -20 - 20 V ID drain current VGS =10V; Tj =25°C; see Figure 1; see Figure 4 [1] - - 136 A Tmb =100 °C; VGS = 10 V; see Figure 1 [2] --75 A VGS =10V; Tj =25°C; see Figure 1 [2] --75 A IDM peak drain current tp ≤ 10 µs; pulsed; Tj =25°C; see Figure 4 - - 543 A Ptot total power dissipation Tmb =25°C; see Figure 2 - - 157 W Tstg storage temperature -55 - 175 °C Tj junction temperature -55 - 175 °C Source-drain diode IS source current Tmb =25°C [2] --75 A [1] - - 136 A ISM peak source current tp ≤ 10 µs; pulsed; Tmb = 25 °C - - 543 A Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy ID =75A; Vsup ≤ 30 V; RGS =50 Ω; VGS =10V; Tj(init) = 25 °C; unclamped - - 329 mJ EDS(AL)R repetitive drain-source avalanche energy see Figure 3 [3][4][5] ---J |
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