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AIC1953 Datasheet(PDF) 9 Page - Analog Intergrations Corporation |
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AIC1953 Datasheet(HTML) 9 Page - Analog Intergrations Corporation |
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9 / 11 page  AIC1953 9 APPLICATION INFORMATION The AIC1953 is a low-dropout, low quiescent-current, dual-output linear regulator for battery power applications. These parts are available with preset output voltages ranging from 0.8V to 3.8V, and the parts can supply loads up to 600mA. CURRENT LIMIT The AIC1953 includes two independent current limiters, which monitor and control the maximum output current. If the output is overloaded or shorted to ground, this can protect the device from being damaged. THERMAL PROTECTION The AIC1953 includes a thermal-limiting circuit, which is designed to protect the device against overload condition. When the junction temperature exceeds TJ=150ºC, the thermal-limiting circuit turns off the pass transistors and allows the IC to cool. For continuous load condition, maximum rating of junction temperature must not be exceeded. INPUT-OUTPUT CAPACITORS Linear regulators require input and output capacitors to maintain stability. Input capacitor at 1 F with a 1F ceramic output capacitor for each regulator is recommended. When choosing the input and output ceramic capacitors, X5R and X7R types are recommended because they retain their capacitance over wider ranges of voltage and temperature than other types. POWER DISSIPATION The maximum power dissipation of AIC1953 depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of temperature rise is greatly affected by the mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. The power dissipation across the device is P = IOUT1 (VIN-VOUT1)+ IOUT2 (VIN-VOUT2) The maximum power dissipation is: JA A max - J MAX R θ ) T - (T P Where TJ-max is the maximum allowable junction temperature (150 C), and T A is the ambient temperature suitable in application. As a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad should provide maximum thermal conductivity to maintain low device temperature. |
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