1.

2.

3.

Material Content Data Sheet

Sales Product Name

PXAC180602MD V1 R500

Issued

17. April 2015

MA#

MA001346732

Package

PG-HB1DSO-4-1

Weight*

1662.56 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

3.928

0.24

0.24

2363

2363

leadframe

inorganic material

phosphorus

7723-14-0

0.054

0.00

33

non noble metal

zinc

7440-66-6

0.216

0.01

130

non noble metal

iron

7439-89-6

4.323

0.26

2600

non noble metal

copper

7440-50-8

175.547

10.56

10.83

105588

108351

wire

noble metal

gold

7440-57-5

10.271

0.62

0.62

6178

6178

encapsulation

organic material

carbon black

1333-86-4

1.804

0.11

1085

plastics

epoxy resin

-

70.347

4.23

42313

inorganic material

silicondioxide

60676-86-0

529.108

31.82

36.16

318248

361646

leadfinish

noble metal

palladium

7440-05-3

0.263

0.02

158

noble metal

gold

7440-57-5

0.230

0.01

139

non noble metal

nickel

7440-02-0

5.953

0.36

0.39

3581

3878

plating

noble metal

palladium

7440-05-3

0.359

0.02

216

noble metal

gold

7440-57-5

0.315

0.02

189

non noble metal

nickel

7440-02-0

8.140

0.49

0.53

4896

5301

heatspreader

non noble metal

iron

7439-89-6

0.852

0.05

512

inorganic material

phosphorus

7723-14-0

0.256

0.02

154

non noble metal

copper

7440-50-8

850.595

51.16

51.23

511617

512283

*deviation

< 10%

Sum in total:

100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com