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TPA3123D2 Datasheet(PDF) 2 Page - Texas Instruments |
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TPA3123D2 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 31 page 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 PVCCL SD PVCCL MUTE LIN RIN BYPASS AGND AGND PVCCR VCLAMP PVCCR PGNDL PGNDL LOUT BSL AVCC AVCC GAIN0 GAIN1 BSR ROUT PGNDR PGNDR TPA3123D2 SLOS541C – JULY 2007 – REVISED AUGUST 2010 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. PWP (TSSOP) PACKAGE (TOP VIEW) Table 1. PIN FUNCTIONS PIN I/O/P DESCRIPTION 24-PIN NAME (PWP) Shutdown signal for IC (low = disabled, high = operational). TTL logic levels with compliance to SD 2 I AVCC RIN 6 I Audio input for right channel LIN 5 I Audio input for left channel GAIN0 18 I Gain select least-significant bit. TTL logic levels with compliance to AVCC GAIN1 17 I Gain select most-significant bit. TTL logic levels with compliance to AVCC Mute signal for quick disable/enable of outputs (high = outputs switch at 50% duty cycle, low = MUTE 4 I outputs enabled). TTL logic levels with compliance to AVCC BSL 21 I/O Bootstrap I/O for left channel PVCCL 1, 3 P Power supply for left-channel H-bridge, not internally connected to PVCCR or AVCC LOUT 22 O Class-D 1/2-H-bridge positive output for left channel PGNDL 23, 24 P Power ground for left-channel H-bridge VCLAMP 11 P Internally generated voltage supply for bootstrap capacitors BSR 16 I/O Bootstrap I/O for right channel ROUT 15 O Class-D 1/2-H-bridge negative output for right channel PGNDR 13, 14 P Power ground for right-channel H-bridge. PVCCR 10, 12 P Power supply for right-channel H-bridge, not connected to PVCCL or AVCC AGND 9 P Analog ground for digital/analog cells in core AGND 8 P Analog ground for analog cells in core Reference for preamplifier inputs. Nominally equal to AVCC/8. Also controls start-up time via BYPASS 7 O external capacitor sizing. AVCC 19, 20 P High-voltage analog power supply. Not internally connected to PVCCR or PVCCL Connect to ground. Thermal pad should be soldered down on all applications to secure the Thermal pad Die pad P device properly to the printed wiring board. 2 Submit Documentation Feedback Copyright © 2007–2010, Texas Instruments Incorporated Product Folder Link(s) :TPA3123D2 |
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