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24C01SC-W08 Datasheet(PDF) 11 Page - Microchip Technology |
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24C01SC-W08 Datasheet(HTML) 11 Page - Microchip Technology |
11 / 12 page 24C01SC/02SC © 1996 Microchip Technology Inc. Preliminary DS21170A-page 11 24C01SC/02SC Product Identification System To order or to obtain information (e.g., on pricing or delivery), please use the listed part numbers, and refer to the factory or the listed sales offices. Die Thickness Blank = 11 mils 08 = 8 mils Other die thicknesses available, please consult factory. Package: S = Die in Wafer Pak W = Wafer WF = Sawed Wafer on Frame Temperature Blank = 0 °C to +70°C Range: Device: 24C01SC 1K 12C ISO Smart Card die 24C02SC 2K 12C ISO Smart Card die 24C01SC/02SC — /S XX |
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