2

FN3143.6

October 30, 2007

Ordering Information

PART

NUMBER

PART MARKING

TEMP. RANGE (°C)

PACKAGE

PKG. DWG. #

HI1-0506A-2

HI1-506A-2

-55 to +125

28 Ld CERDIP

F28.6

HI1-0506A-5

HI1-506A-5

0 to +75

28 Ld CERDIP

F28.6

HI1-0506A-8

HI1-506A-8

-55 to +125

+ 160 Hour Burn-In

28 Ld CERDIP

F28.6

HI3-0506A-5

HI3-506A-5

0 to +75

28 Ld PDIP

E28.6

HI3-0506A-5Z (Note 1)

HI3-506A-5Z

0 to +75

28 Ld PDIP (Note 2) (Pb-free)

E28.6

HI3-0507A-5

HI3-507A-5

0 to +75

28 Ld PDIP

E28.6

HI3-0507A-5Z (Note 1)

HI3-507A-5Z

0 to +75

28 Ld PDIP (Note 2) (Pb-free)

E28.6

HI1-0508A-8

HI1-508A-8

-55 to +125

+ 160 Hour Burn-In

16 Ld CERDIP

F16.3

HI3-0508A-5

HI3-508A-5

0 to +75

16 Ld PDIP

E16.3

HI3-0508A-5Z (Note 1)

HI3-508A-5Z

0 to +75

16 Ld PDIP (Note 2) (Pb-free)

E16.3

HI1-0509A-2

HI1-509A-2

-55 to +125

16 Ld CERDIP

F16.3

HI1-0509A-5

HI1-509A-5

0 to +75

16 Ld CERDIP

F16.3

HI1-0509A-8

HI1-509A-8

-55 to +125

+ 160 Hour Burn-In

16 Ld CERDIP

F16.3

HI3-0509A-5

HI3-509A-5

0 to +75

16 Ld PDIP

E16.3

HI3-0509A-5Z (Note 1)

HI3-509A-5Z

0 to +75

16 Ld PDIP (Note 2) (Pb-free)

E16.3

NOTES:

1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte

tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.

Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC

J STD-020.

2. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.

HI-506A, HI-507A, HI-508A, HI-509A