ISL29027

9

FN7815.1

February 2, 2012

Typical Circuit

A typical application for the ISL29027 is shown in Figure 6. The

Soldering Considerations

Convection heating is recommended for reflow soldering; direct-

infrared heating is not recommended. The plastic ODFN package

does not require a custom reflow soldering profile, and is qualified to

+260°C. A standard reflow soldering profile with a +260°C

maximum is recommended.

Suggested PCB Footprint

It is important that users check the “Surface Mount Assembly

Guidelines for Optical Dual FlatPack No Lead (ODFN) Package”

before starting ODFN product board mounting.

http://www.intersil.com/data/tb/TB477.pdf

Layout Considerations

The ISL29027 is relatively insensitive to layout. Like other I2C

devices, it is intended to provide excellent performance even in

significantly noisy environments. There are only a few

considerations that will ensure best performance.

sources of noise. 0.1µF and 1µF power supply decoupling

capacitors need to be placed close to the device.

ADDR0

1

GND

3

REXT

4

SDA

INT

7

IRDR

8

ISL29027

R1

10kΩ

R2

10kΩ

REXT

499kΩ

MICROCONTROLLER

INT

SDA

SLAVE_0

SLAVE_1

SCL

SDA

SCL

SDA

6

R3

10kΩ

SCL

2 VDD

5

C2

0.1µF

FIGURE 6. ISL29027 TYPICAL CIRCUIT

SCL

C1

1µF