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27LV256-25P Datasheet(PDF) 1 Page - Microchip Technology

Part # 27LV256-25P
Description  256K (32K x 8) Low-Voltage CMOS EPROM
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

27LV256-25P Datasheet(HTML) 1 Page - Microchip Technology

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© 1996 Microchip Technology Inc.
DS11020F-page 1
27LV256
FEATURES
• Wide voltage range 3.0V to 5.5V
• High speed performance
- 200 ns access time available at 3.0V
• CMOS Technology for low power consumption
- 8 mA Active current at 3.0V
- 20 mA Active current at 5.5V
- 100
µA Standby current
• Factory programming available
• Auto-insertion-compatible plastic packages
• Auto ID aids automated programming
• Separate chip enable and output enable controls
• High speed “Express” programming algorithm
• Organized 32K x 8: JEDEC standard pinouts
- 28-pin Dual-in-line package
- 32-pin PLCC package
- 28-pin SOIC package
- 28-pin VSOP package
- Tape and reel
• Data Retention > 200 years
• Available for the following temperature ranges:
- Commercial:
0˚C to +70˚C
- Industrial:
-40˚C to +85˚C
DESCRIPTION
The Microchip Technology Inc. 27LV256 is a low volt-
age (3.0 volt) CMOS EPROM designed for battery
powered applications. The device is organized as a
32K x 8 (32K-Byte) non-volatile memory product. The
27LV256 consumes only 8 mA maximum of active cur-
rent during a 3.0 volt read operation therefore improv-
ing battery performance. This device is designed for
very low voltage applications where conventional 5.0
volt only EPROMS can not be used. Accessing individ-
ual bytes from an address transition or from power-up
(chip enable pin going low) is accomplished in less than
200 ns at 3.0V. This device allows systems designers
the ability to use low voltage non-volatile memory with
today’s' low voltage microprocessors and peripherals
in battery powered applications.
A complete family of packages is offered to provide the
most flexibility in applications. For surface mount appli-
cations, PLCC, VSOP or SOIC packaging is available.
Tape and reel packaging is also available for PLCC or
SOIC packages.
PACKAGE TYPES
• 1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
A12
A7
A6
A5
A4
A3
A2
A1
A0
O0
O1
O2
V
V
A14
A13
A8
A9
A11
OE
A10
CE
O7
O6
O5
O4
O3
PP
SS
CC
A6
A5
A4
A3
A2
A1
A0
NC
O0
A8
A9
A11
NC
OE
A10
CE
O7
O6
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VPP
A12
A7
A6
A5
A4
A3
A2
A1
A0
O0
O1
O2
VSS
VCC
A14
A13
A8
A9
A11
OE
A10
CE
O7
O6
O5
O4
O3
A10
CE
21
20
19
VSS
O2
14
13
12
OE
A11
A9
A8
22
23
24
VPP
A12
A7
1
2
3
4
5
25
26
27
28
6
7
A13
A14
VCC
A6
A5
A4
A3
O7
O6
O5
O4
O3
O1
O0
A0
A1
A2
18
17
16
15
11
10
9
8
PDIP
PLCC
SOIC
VSOP
256K (32K x 8) Low-Voltage CMOS EPROM
This document was created with FrameMaker404


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