Data Sheet

8

Rev. 1.11, 2015-01-30

IFX1763XEJV50

IFX1763LDV50

General Product Characteristics

4.2

Functional Range

Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical

characteristics are specified within the conditions given in the Electrical Characteristics table.

4.3

Thermal Resistance

Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go

to www.jedec.org.

Table 2

Functional Range

Parameter

Symbol

Values

Unit

Note /

Test Condition

Number

Min.

Typ.

Max.

Input Voltage Range

V

IN

5.5

–

20

V

–

P_4.2.1

Operating Junction Temperature

T

j

-40

–

125

°C

–

P_4.2.2

Table 3

1) Not subject to production test, specified by design.

Parameter

Symbol

Values

Unit

Note /

Test Condition

Number

Min.

Typ.

Max.

IFX1763X EJ (PG-DSO-8 Exposed Pad)

Junction to Case

R

thJC

–

7.0

–

K/W

–

P_4.3.1

Junction to Ambient

R

thJA

–39

–

K/W

2) Specified

R

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).

Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.

P_4.3.2

Junction to Ambient

R

thJA

–

155

–

K/W

3) Specified

R

P_4.3.3

Junction to Ambient

R

thJA

–66

–

K/W

area on PCB3)

P_4.3.4

Junction to Ambient

R

thJA

–52

–

K/W

area on PCB3)

P_4.3.5

IFX1763 LD (PG-TSON10)

Junction to Case

R

thJC

–

6.4

–

K/W

–

P_4.3.6

Junction to Ambient

R

thJA

–53

–

K/W

–2)

P_4.3.7

Junction to Ambient

R

thJA

–

183

–

K/W

Footprint only3)

P_4.3.8

Junction to Ambient

R

thJA

–69

–

K/W

area on PCB3)

P_4.3.9

Junction to Ambient

R

thJA

–57

–

K/W

area on PCB3)

P_4.3.10