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Material Content Data Sheet

Sales Product Name

2EDL05I06PJ

Issued

5. February 2015

MA#

MA001331390

Package

PG-DSO-14-49

Weight*

138.83 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

0.952

0.69

0.69

6858

6858

leadframe

inorganic material

phosphorus

7723-14-0

0.014

0.01

103

non noble metal

zinc

7440-66-6

0.057

0.04

414

non noble metal

iron

7439-89-6

1.150

0.83

8280

non noble metal

copper

7440-50-8

46.675

33.62

34.50

336194

344991

wire

noble metal

gold

7440-57-5

0.228

0.16

0.16

1644

1644

encapsulation

organic material

carbon black

1333-86-4

0.175

0.13

1263

plastics

epoxy resin

-

9.470

6.82

68209

inorganic material

silicondioxide

60676-86-0

78.036

56.21

63.16

562090

631562

leadfinish

non noble metal

tin

7440-31-5

1.226

0.88

0.88

8832

8832

plating

noble metal

silver

7440-22-4

0.307

0.22

0.22

2208

2208

glue

plastics

acrylic resin

-

0.119

0.09

859

noble metal

silver

7440-22-4

0.423

0.30

0.39

3046

3905

*deviation

< 10%

Sum in total:

100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com