TPS783

SBVS133A – FEBRUARY 2010 – REVISED NOVEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

–0.3

6.0

V

Voltage

EN pin

–0.3

V

–0.3

V

Internally limited

A

Current

Output short-circuit duration

Indefinite

Temperature

–40

160

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–55

150

°C

–2000

2000

Electrostatic

V

discharge

–500

500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

2.2

5.5

V

Output voltage

1.8

4.2

V

Enable voltage

0

V

Output current

0

150

mA

Junction temperature

–40

105

°C

6.4 Thermal Information

TPS783xx

DDC (SOT)

UNIT

5 PINS

Junction-to-ambient thermal resistance

193.0

Junction-to-case (top) thermal resistance

40.0

Junction-to-board thermal resistance

34.3

°C/W

Junction-to-top characterization parameter

0.9

Junction-to-board characterization parameter

34.1

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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