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Material Content Data Sheet

Sales Product Name

IPU60R1K4C6

Issued

8. October 2014

MA#

MA000974352

Package

PG-TO251-3-341

Weight*

381.14 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

1.624

0.43

0.43

4261

4261

leadframe

non noble metal

iron

7439-89-6

0.229

0.06

601

inorganic material

phosphorus

7723-14-0

0.069

0.02

180

non noble metal

copper

7440-50-8

228.946

60.08

60.16

600689

601470

wire

non noble metal

aluminium

7429-90-5

0.430

0.11

0.11

1129

1129

encapsulation

inorganic material

antimonytrioxide

1309-64-4

1.743

0.46

4573

plastics

brominated resin

-

1.868

0.49

4900

organic material

carbon black

1333-86-4

1.992

0.52

5227

plastics

epoxy resin

-

16.808

4.41

44099

inorganic material

silicondioxide

60676-86-0

102.092

26.79

32.67

267860

326659

leadfinish

non noble metal

tin

7440-31-5

3.740

0.98

0.98

9813

9813

plating

non noble metal

nickel

7440-02-0

0.509

0.13

0.13

1335

1335

solder

noble metal

silver

7440-22-4

0.047

0.01

124

non noble metal

tin

7440-31-5

0.038

0.01

99

non noble metal

lead

7439-92-1

1.802

0.47

0.49

4729

4952

heatspreader

non noble metal

iron

7439-89-6

0.019

0.00

50

inorganic material

phosphorus

7723-14-0

0.006

0.00

15

non noble metal

copper

7440-50-8

19.177

5.03

5.03

50316

50381

*deviation

< 10%

Sum in total:

100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption

7a, Lead in high melting temperature type solders.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com