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RFM75 V1.0 

E‐mail:sales@hoperf.com                 website://www.hoperf.com  

Table of Contents

1

General Description ................................................................................................................. 3

2

Abbreviations .......................................................................................................................... 4

3

Pin Information ....................................................................................................................... 5

4

State Control ........................................................................................................................... 6

4.1

State Control Diagram ............................................................................................................... 6

4.2

Power Down Mode.................................................................................................................... 7

4.3

Standby-I Mode ......................................................................................................................... 7

4.4

Standby-II Mode........................................................................................................................ 7

4.5

TX Mode ................................................................................................................................... 7

4.6

RX Mode ................................................................................................................................... 8

5

Packet Processing .................................................................................................................... 8

5.1

Packet Format............................................................................................................................ 8

5.1.1

Preamble........................................................................................................................... 9

5.1.2

Address............................................................................................................................. 9

5.1.3

Packet Control .................................................................................................................. 9

5.1.4

Payload ........................................................................................................................... 10

5.1.5

CRC................................................................................................................................ 10

5.2

Packet Handling ...................................................................................................................... 10

6

Data and Control Interface .................................................................................................... 11

6.1

TX/RX FIFO ........................................................................................................................... 11

6.2

Interrupt ................................................................................................................................... 11

6.3

SPI Interface ............................................................................................................................ 12

6.3.1

SPI Command ................................................................................................................ 12

6.3.2

SPI Timing ..................................................................................................................... 13

7

Register Map ......................................................................................................................... 15

7.1

Register Bank 0 ....................................................................................................................... 15

7.2

Register Bank 1 ....................................................................................................................... 21

8

Electrical Specifications ......................................................................................................... 22

9

Typical Application Schematic............................................................................................... 23

10

Package and Die Bonding Information................................................................................... 24

10.1

Package Information ........................................................................................................... 24

10.2

Die Bonding Information .................................................................................................... 25

10.3

PCB Bonding diagram ........................................................................................................ 27

11

Order Information ................................................................................................................. 28

12

Contact Information .............................................................................................................. 29

13

Update History ...................................................................................................................... 30