LM22679, LM22679-Q1

SNVS581L – FEBRUARY 2013 – REVISED NOVEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

VIN to GND

43

V

SS, IADJ Pin Voltage

–0.5

7

V

–5

V

Boot Pin Voltage

V

FB Pin Voltage

–0.5

7

V

Power Dissipation

Internally Limited

150

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of

device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or

other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating

Conditions indicate conditions at which the device is functional and should not be operated beyond such conditions.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

The absolute-maximum specification of the ‘SW to GND’ applies to dc voltage. An extended negative voltage limit of –10 V applies to a

pulse of up to 50 ns.

(4)

For soldering specifications, refer to refer to application report Absolute Maximum Ratings for Soldering (SNOA549).

6.2 Handling Ratings: LM22679

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

Electrostatic discharge

–2

2

kV

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Handling Ratings: LM22679-Q1

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

Electrostatic discharge

–2

2

kV

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply Voltage

4.5

42

V

Junction Temperature Range

–40

125

°C

6.5 Thermal Information

LM22679

NDR

UNIT

7 PINS

Junction-to-ambient thermal resistance

22

°C/W

(1)

For more information about traditional and new thermal metrics, see the application report IC Package Thermal Metrics (SPRA953).

(2)

range from 20 to 30°C/W depending on the amount of PCB copper dedicated to heat transfer. See application note AN-1797 TO-263

THIN Package (SNVA328) for more information.

4

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