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23ACC12T4V10 Datasheet(PDF) 2 Page - List of Unclassifed Manufacturers |
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2 / 8 page SKiiP 23ACC12T4V10 2 Rev. 3 – 02.04.2015 © by SEMIKRON MiniSKiiP® 2 ACC Twin 6-pack SKiiP 23ACC12T4V10 Target Data Features •Trench 4 IGBTs • Robust and soft freewheeling diodes in CAL technology • Highly reliable spring contacts for electrical connections • UL recognised: File no. E63532 Typical Applications* •4Q inverters Remarks • Max. case temperature limited to TC=125°C • Short circuit behaviour of one leg must be verified in the final application Characteristics Symbol Conditions min. typ. max. Unit IGBT 1 - 6 VCE(sat) IC =15A VGE =15 V chiplevel Tj =25 °C 1.85 2.10 V Tj =150 °C 2.25 2.45 V VCE0 chiplevel Tj =25 °C 0.8 0.9 V Tj =150 °C 0.7 0.8 V rCE VGE =15 V chiplevel Tj =25 °C 70 80 mΩ Tj =150 °C 103 110 mΩ VGE(th) VGE =VCE V, IC =1 mA 55.8 6.5 V ICES VGE =0 V VCE = 1200 V Tj =25 °C 0.1 0.3 mA mA Cies VCE =25V VGE =0 V f=1MHz 0.90 nF Coes f=1MHz 0.08 nF Cres f=1MHz 0.06 nF QG VGE = - 8 V...+ 15 V 85 nC RGint Tj =25°C 0 Ω td(on) VCC = 600 V IC =15A RG on =39 Ω RG off =39 Ω di/dton =400 A/µs di/dtoff =200 A/µs VGE = +15/-15 V Tj =150 °C 31 ns tr Tj =150 °C 30 ns Eon Tj =150 °C 1.65 mJ td(off) Tj =150 °C 315 ns tf Tj =150 °C 66 ns Eoff Tj =150 °C 1.5 mJ Rth(j-s) per IGBT, λpaste=0.8 W/K*m 1.3 K/W IGBT 7 - 12 VCE(sat) IC =25A VGE =15 V chiplevel Tj =25 °C 1.85 2.10 V Tj =150 °C 2.25 2.45 V VCE0 chiplevel Tj =25 °C 0.8 0.9 V Tj =150 °C 0.7 0.8 V rCE VGE =15 V chiplevel Tj =25 °C 42 48 mΩ Tj =150 °C 62 66 mΩ VGE(th) VGE =VCE V, IC =1 mA 55.8 6.5 V ICES VGE =0 V VCE = 1200 V Tj =25 °C 0.1 0.3 mA mA Cies VCE =25V VGE =0 V f=1MHz 1.43 nF Coes f=1MHz 0.12 nF Cres f=1MHz 0.09 nF QG VGE = - 8 V...+ 15 V 142 nC RGint Tj =25°C 0 Ω td(on) VCC = 600 V IC =25A RG on =39 Ω RG off =39 Ω di/dton =465 A/µs di/dtoff =350 A/µs VGE = +15/-15 V Tj =150 °C 44 ns tr Tj =150 °C 46 ns Eon Tj =150 °C 3.7 mJ td(off) Tj =150 °C 330 ns tf Tj =150 °C 62 ns Eoff Tj =150 °C 2.4 mJ Rth(j-s) per IGBT, λpaste=0.8 W/K*m 1K/W |
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