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TPS40305 Datasheet(PDF) 11 Page - Texas Instruments |
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TPS40305 Datasheet(HTML) 11 Page - Texas Instruments |
11 / 37 page ( ) ( ) P P OCLOS OUT max DS on OCSET OCSET I I R V 2 R 2 I - æ ö æ ö æ ö - ´ - ç ÷ ç ÷ ç ÷ è ø ç ÷ è ø = ç ÷ ´ ç ÷ ç ÷ è ø TPS40303, TPS40304, TPS40305 www.ti.com SLUS964B – NOVEMBER 2009 – REVISED MAY 2015 Feature Description (continued) 7.3.4 Oscillator and Frequency Spread Spectrum (FSS) The oscillator frequency is internally fixed. The TPS40303 operating frequency is 300 kHz, the TPS40304 operating frequency is 600 kHz, and the TPS40305 operating frequency is 1.2 MHz. Connecting a resistor with a value of 267 k Ω ±10% from BP to EN/SS enables the FSS feature. When the FSS is enabled, it spreads the internal oscillator frequency over a minimum 12% window using a 25-kHz modulation frequency with triangular profile. By modulating the switching frequency, side-bands are created. The emission power of the fundamental switching frequency and its harmonics is distributed into smaller pieces scattered around many sideband frequencies. The effect significantly reduces the peak EMI noise and makes it much easier for the resultant emission spectrum to pass EMI regulations. 7.3.5 Overcurrent Protection Programmable OCP level at LDRV is from 6 mV to 150 mV at room temperature with 3000 ppm temperature coefficient to help compensate for changes in the low-side FET channel resistance as temperature increases. With a scale factor of 2, the actual trip point across the low-side FET is in the range of 12 mV to 300 mV. The accuracy of the internal current source is ±5%. Overall offset voltage, including the offset voltage of the internal comparator and the amplifier for scale factor of 2, is limited to ±8 mV. Maximum clamp voltage at LDRV is 340 mV to avoid turning on the low-side FET during calibration and in a prebiased condition. The maximum clamp voltage is fixed and it does not change with temperature. If the voltage drop across ROCSET reaches the 340-mV maximum clamp voltage during calibration (no ROCSET resistor included), it disables OC protection. Once disabled, there is no low-side or high-side current sensing. OCP level at HDRV is fixed at 450 mV with 3000-ppm temperature coefficient to help compensate for changes in the high-side FET channel resistance as temperature increases. OCP at HDRV provides pulse-by-pulse current limiting. OCP sensing at LDRV is a true inductor valley current detection, using sample and hold. Equation 2 can be used to calculate ROCSET: where • IOCSET is the internal current source. • VOCLOS is the overall offset voltage. • IP-P is the peak-to-peak inductor current. • RDS(on) is the drain to source ON-resistance of the low-side FET. • IOUT(max) is the trip point for OCP. • ROCSET is the resistor used for setting the OCP level. (2) To avoid overcurrent tripping in normal operating load range, calculate ROCSET using the equation above with: • The maximum RDS(ON) at room temperature • The lower limit of VOCLOS (–8 mV) and the lower limit of IOCSET (9.5 µA) from the Electrical Characteristics table. • The peak-to-peak inductor current IP-P at minimum input voltage Overcurrent is sensed across both the low-side FET and the high-side FET. If the voltage drop across either FET exceeds the OC threshold, a count increments one count. If no OC is detected on either FET, the fault counter decrements by one count. If three OC pulses are summed, a fault condition is declared which cycles the soft- start function in a hiccup mode. Hiccup mode consists of four dummy soft-start timeouts followed by a real one if overcurrent condition is encountered during normal operation, or five dummy soft-start timeouts followed by a real one if overcurrent condition occurs from the beginning during start. This cycle continues indefinitely until the fault condition is removed. Copyright © 2009–2015, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: TPS40303 TPS40304 TPS40305 |
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