TPS54325

SLVS932F – MAY 2009 – REVISED NOVEMBER 2014

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

20

V

–0.3

26

V

–0.3

6.5

V

Input voltage range

–0.3

6.5

V

SW1, SW2

–2

20

V

SW1, SW2 (10 ns transient)

–3

20

V

–0.3

6.5

V

Output voltage range

–0.3

0.3

V

Voltage from GND to POWERPAD

–0.2

0.2

V

Operating junction temperature

–40

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–55

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-

500

(1)

JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 500-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Thermal Information

PWP

UNIT

12 PINS

Junction-to-ambient thermal resistance

55.6

Junction-to-case (top) thermal resistance

51.3

Junction-to-board thermal resistance

26.4

°C/W

Junction-to-top characterization parameter

1.8

Junction-to-board characterization parameter

20.6

Junction-to-case (bottom) thermal resistance

4.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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