HX318C9T3K4-16 datasheet(1/2 Pages) ETC2

Part #	HX318C9T3K4-16

Description	DDR3-1866 CL9 240-Pin DIMM Kit

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HX318C9T3K4/16

16GB (4GB 512M x 64-Bit x 4 pcs.)

DDR3-1866 CL9 240-Pin DIMM Kit

DESCRIPTION

HyperX HX318C9T3K4/16 is a kit of four 512M x 64-bit (4GB)

DDR3-1866 CL9 SDRAM (Synchronous DRAM), 1Rx8

memory modules, based on eight 512M x 8-bit FBGA

components per module. Each module kit supports Intel®

XMP (Extreme Memory Profiles). Total kit capacity is 16GB.

Each module kit has been tested to run at DDR3-1866 at a

low latency timing of 9-10-11 at 1.5V. The SPDs are

programmed to JEDEC standard latency DDR3-1600 timing of

11-11-11 at 1.5V. Each 240-pin DIMM uses gold contact

fingers. The JEDEC standard electrical and mechanical

specifications are as follows:

Document No. 4807095-001.A00

07/23/14

Page 1

SPECIFICATIONS

11 cycles

)

D

I

(

L

C

Row Cycle Time (tRCmin)

48.125ns (min.)

Refresh to Active/Refresh

260ns (min.)

Command Time (tRFCmin)

Row Active Time (tRASmin)

35ns (min.)

Maximum Operating Power

TBD W* (per module)

0

-

V

4

9

g

n

i

t

a

R

L

U

Operating Temperature

0o C to 85o C

Storage Temperature

-55o C to +100o C

*Power will vary depending on the SDRAM used.

FEATURES

• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply

• VDDQ = 1.5V (1.425V ~ 1.575V)

• 800MHz fCK for 1600Mb/sec/pin

• 8 independent internal bank

• Programmable CAS Latency: 11, 10, 9, 8, 7, 6

• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

• 8-bit pre-fetch

• Burst Length: 8 (Interleave without any limit, sequential with

starting address “000” only), 4 with tCCD = 4 which does not

allow seamless read or write [either on the fly using A12 or

MRS]

• Bi-directional Differential Data Strobe

• Internal(self) calibration : Internal self calibration through ZQ

pin (RZQ : 240 ohm ± 1%)

• On Die Termination using ODT pin

• Average Refresh Period 7.8us at lower than TCASE 85°C,

3.9us at 85°C < TCASE < 95°C

• Asynchronous Reset

• Height 1.827” (46.41mm) w/ heatsink, single sided

component

Continued >>

XMP TIMING PARAMETERS

• JEDEC: DDR3-1600 CL11-11-11 @1.5V

• XMP Profile #1: DDR3-1866 CL9-10-11 @1.5V

• XMP Profile #2: DDR3-1600 CL9-9-9 @1.5V

kingston.com/hyperx

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