LMZ10503EXT

SNVS668H – JUNE 2010 – REVISED SEPTEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

VIN, VOUT, EN, FB, SS to GND

–0.3

6

V

Power Dissipation

Internally Limited

Junction Temperature

150

°C

Peak Reflow Case Temperature (30 sec)

245

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

For soldering specifications, refer to the following document: SNOA549

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

(1)

The human body model is a 100-pF capacitor discharged through a 1.5-k

Ω resistor into each pin. Test method is per JESD22-AI14S.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN to GND

2.95

5.5

V

–55

125

°C

6.4 Thermal Information

LMZ10503EXT

NDW (TO-PMOD)

UNIT

7 PINS

20

°C/W

Junction-to-case (top) thermal resistance (no air flow)

1.9

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

power dissipation. Refer to Evaluation Board Application Note: AN-2074 (SNVA450).

4

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