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MT46V64M4FJ-6 Datasheet(PDF) 2 Page - Micron Technology |
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MT46V64M4FJ-6 Datasheet(HTML) 2 Page - Micron Technology |
2 / 8 page 2 256Mb: x4, x8, x16 DDR333 SDRAM Micron Technology, Inc., reserves the right to change products or specifications without notice. 256Mx4x8x16DDR333_B.p65 – Rev. B; Pub. 10/01 ©2001, Micron Technology, Inc. 256Mb: x4, x8, x16 DDR333 SDRAM Addendum PRELIMINARY FBGA PACKAGE PINOUT VSS Q DQ14 DQ12 DQ10 DQ8 VREF DQ15 VDDQ VSSQ VDDQ VSSQ VSS CK A12 A11 A8 A6 A4 VSS DQ13 DQ11 DQ9 UDQS UDM CK# CKE A9 A7 A5 VSS VDD DQ2 DQ4 DQ6 LDQS LDM WE# RAS# BA1 A0 A2 VDD DQ0 VSSQ VDDQ VSSQ VDDQ VDD CAS# CS# BA0 A10 A1 A3 VDDQ DQ1 DQ3 DQ5 DQ7 A13 x16 (Top View) VSS Q NC NC NC NC VREF NC VDDQ VSSQ VDDQ VSSQ VSS CK A12 A11 A8 A6 A4 VSS DQ3 NC DQ2 DQS DM CK# CKE A9 A7 A5 VSS VDD DQ0 NC DQ1 NC NC WE# RAS# BA1 A0 A2 VDD NC VSSQ VDDQ VSSQ VDDQ VDD CAS# CS# BA0 A10 A1 A3 VDDQ NC NC NC NC A13 x4 (Top View) VSS Q NC NC NC NC VREF DQ7 VDDQ VSSQ VDDQ VSSQ VSS CK A12 A11 A8 A6 A4 VSS DQ6 DQ5 DQ4 DQS DM CK# CKE A9 A7 A5 VSS VDD DQ1 DQ2 DQ3 NC NC WE# RAS# BA1 A0 A2 VDD DQ0 VSSQ VDDQ VSSQ VDDQ VDD CAS# CS# BA0 A10 A1 A3 VDDQ NC NC NC NC A13 x8 (Top View) 12 3 4 5 6 7 8 9 A B C D E F G H J K L M A B C D E F G H J K L M 12 3 4 5 6 7 8 9 A B C D E F G H J K L M A B C D E F G H J K L M 12 3 4 5 6 7 8 9 L A B C D E F G H J K M L A B C D E F G H J K M FBGA PACKAGE MARKING FBGA 60-BALL PACKAGE DIMENSION Due to the physical size of the FBGA package, the full ordering part number is not printed on the package. Instead the following package code is utilized. Top mark contains five fields 12345 • Field 1 (Product Family) DRAM D DRAM - ES Z • Field 2 (Product Type) 2.5 Volt, DDR SDRAM, 60-ball L • Field 3 (Width) x4 devices B x8 devices C x16 devices D • Field 4 (Density / Size) 256Mb H • Filed 5 (Speed Grade) -6 J -75Z P -75 F -8 C Example top mark for a MT46V32M4FJ-6: DLBFJ 1.20 MAX MOLD COMPOUND: EPOXY NOVOLAC SUBSTRATE: PLASTIC LAMINATE SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or 62% Sn, 36% Pb, 2%Ag SOLDER BALL PAD: Ø .33mm 0.850 ±0.075 16.00 ±0.10 8.00 ±0.05 SEATING PLANE C 0.10 C BALL A1 BALL A9 PIN A1 ID 61X ∅0.45 SOLDER BALL DIAMETER REFERS TO POST REFLOW CONDITION. THE PRE- REFLOW DIAMETER IS Ø 0.40 5.50 ±0.05 11.00 1.00 TYP 0.80 TYP 1.80 CTR 9 .00 ±0.10 3.20 ±0.05 4.50 ±0.05 6.40 CL CL Bottom View |
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