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Material Content Data Sheet

Sales Product Name

BB 640 E6327

Issued

29. August 2013

MA#

MA000314957

Package

PG-SOD323-2-1

Weight*

4.48 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

non noble metal

arsenic

7440-38-2

0.000

0.00

17

noble metal

gold

7440-57-5

0.008

0.17

1726

inorganic material

silicon

7440-21-3

0.066

1.47

1.64

14745

16488

leadframe

non noble metal

chromium

7440-47-3

0.004

0.09

933

inorganic material

silicon

7440-21-3

0.000

0.01

62

non noble metal

titanium

7440-32-6

0.001

0.03

311

non noble metal

copper

7440-50-8

1.387

30.96

31.09

309639

310945

wire

noble metal

gold

7440-57-5

0.019

0.42

0.42

4197

4197

encapsulation

inorganic material

antimonytrioxide

1309-64-4

0.032

0.71

7066

organic material

carbon black

1333-86-4

0.032

0.71

7066

plastics

brominated resin

-

0.078

1.73

17343

plastics

epoxy resin

-

0.722

16.12

161222

inorganic material

silicondioxide

60676-86-0

2.014

44.97

64.24

449624

642321

leadfinish

non noble metal

tin

7440-31-5

0.076

1.70

1.70

16998

16998

plating

noble metal

silver

7440-22-4

0.041

0.91

0.91

9051

9051

*deviation

< 10%

Sum in total:

100,00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com