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NCS4333 Datasheet(PDF) 9 Page - ON Semiconductor |
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NCS4333 Datasheet(HTML) 9 Page - ON Semiconductor |
9 / 15 page NCS333, NCV333, NCS2333, NCV2333, NCS4333, NCV4333 www.onsemi.com 9 APPLICATIONS INFORMATION APPLICATION CIRCUITS Low−Side Current Sensing The goal of low−side current sensing is to detect over−current conditions or as a method of feedback control. A sense resistor is placed in series with the load to ground. Typically, the value of the sense resistor is less than 100 m W to reduce power loss across the resistor. The op amp amplifies the voltage drop across the sense resistor with a gain set by external resistors R1, R2, R3, and R4 (where R1 = R2, R3 = R4). Precision resistors are required for high accuracy, and the gain is set to utilize the full scale of the ADC for the highest resolution. + − Load VDD ADC Microcontroller control RSENSE R1 R2 R3 R4 VDD VDD VLOAD Figure 17. Low−Side Current Sensing Differential Amplifier for Bridged Circuits Sensors to measure strain, pressure, and temperature are often configured in a Wheatstone bridge circuit as shown in Figure 18. In the measurement, the voltage change that is produced is relatively small and needs to be amplified before going into an ADC. Precision amplifiers are recommended in these types of applications due to their high gain, low noise, and low offset voltage. Figure 18. Bridge Circuit Amplification + − VDD VDD EMI Susceptibility and Input Filtering Op amps have varying amounts of EMI susceptibility. Semiconductor junctions can pick up and rectify EMI signals, creating an EMI−induced voltage offset at the output, adding another component to the total error. Input pins are the most sensitive to EMI. The NCS333 op amp family integrates low−pass filters to decrease sensitivity to EMI. General Layout Guidelines To ensure optimum device performance, it is important to follow good PCB design practices. Place 0.1 mF decoupling capacitors as close as possible to the supply pins. Keep traces short, utilize a ground plane, choose surface−mount components, and place components as close as possible to the device pins. These techniques will reduce susceptibility to electromagnetic interference (EMI). Thermoelectric effects can create an additional temperature dependent offset voltage at the input pins. To reduce these effects, use metals with low thermoelectric−coefficients and prevent temperature gradients from heat sources or cooling fans. |
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