TPS65253

SLVSAW8

– JUNE 2011

www.ti.com

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

Voltage range at VIN1,VIN2, LX1, LX2

–0.3 to 18

V

Voltage range at LX1, LX2 (maximum withstand voltage transient

–3 to 18

V

Voltage at BST1, BST2, referenced to LX pin

–0.3 to 7

V

Voltage at V7V, CMP1, CMP2

–0.3 to 7

V

Voltage at V3V, RLIM1, RLIM2, EN1, EN2, SS1, SS2, FB1, FB2, PGOOD, ROSC, LOW_P

–0.3 to 3.6

V

Voltage at GND

–0.3 to 0.3

V

Operating virtual junction temperature range

–40 to 125

°C

Storage temperature range

–55 to 150

°C

(1)

Stresses beyond those listed under

"absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under

"recommended operating

conditions

" is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

(2)

Excessive parasitic inductance may cause deeper negative voltage for less than 20 ns. To minimize this undershoot tight board layout is

recommended.

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input operating voltage

4.5

16

V

Junction temperature

–40

85

°C

ELECTROSTATIC DISCHARGE (ESD) PROTECTION

MIN

MAX

UNIT

Human body model (HBM)

2000

V

Charge device model (CDM)

500

V

PACKAGE DISSIPATION RATINGS

(1)

PACKAGE

POWER RATING (W)

POWER RATING (W)

RHD

34 (Simulated)

2.9

2

(1)

Based on JEDEC 51.5 HIGH K environment measured on a 76.2 x 114 x 0.6-mm board with the following layer arrangement:

(a) Top layer: 2 Oz Cu, 6.7% coverage

(b) Layer 2: 1 Oz Cu, 90% coverage

(c) Layer 3: 1 Oz Cu, 90% coverage

(d) Bottom layer: 2 Oz Cu, 20% coverage

6

Copyright

© 2011, Texas Instruments Incorporated