TPS65251-1, TPS65251-2, TPS65251-3

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SLVSC70A – JANUARY 2015 – REVISED JANUARY 2015

6 Specifications

6.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN1,VIN2, VIN3, LX1, LX2, LX3

–0.3

18

V

LX1, LX2, LX3 (maximum withstand voltage transient <10 ns)

–1

18

V

BST1, BST2, BST3, referenced to Lx pin

–0.3

7

V

Voltage

V7V

–0.3

7

V

V3V, RLIM1, RLIM2, RLIM3, EN1, EN2, EN3, SS1, SS2,SS3, FB1, FB2, FB3, PGOOD, SYNC,

–0.3

3.6

V

ROSC, RST_IN, LOW_P, COMP1, COMP2, COMP3

AGND, GND

–0.3

0.3

V

Operating virtual junction temperature

–40

125

°C

Storage temperature

–55

150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic

V

discharge

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input operating voltage

4.5

18

V

Junction temperature

–40

125

°C

6.4 Thermal Information

TPS65251-x

RHA

UNIT

40 PINS

Junction-to-ambient thermal resistance

32.7

Junction-to-case (top) thermal resistance

21.4

Junction-to-board thermal resistance

8.3

°C/W

Junction-to-top characterization parameter

0.2

Junction-to-board characterization parameter

N/A

Junction-to-case (bottom) thermal resistance

2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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