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TPS65251-3RHAT Datasheet(PDF) 5 Page - Texas Instruments |
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TPS65251-3RHAT Datasheet(HTML) 5 Page - Texas Instruments |
5 / 39 page TPS65251-1, TPS65251-2, TPS65251-3 www.ti.com SLVSC70A – JANUARY 2015 – REVISED JANUARY 2015 6 Specifications 6.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN1,VIN2, VIN3, LX1, LX2, LX3 –0.3 18 V LX1, LX2, LX3 (maximum withstand voltage transient <10 ns) –1 18 V BST1, BST2, BST3, referenced to Lx pin –0.3 7 V Voltage V7V –0.3 7 V V3V, RLIM1, RLIM2, RLIM3, EN1, EN2, EN3, SS1, SS2,SS3, FB1, FB2, FB3, PGOOD, SYNC, –0.3 3.6 V ROSC, RST_IN, LOW_P, COMP1, COMP2, COMP3 AGND, GND –0.3 0.3 V TJ Operating virtual junction temperature –40 125 °C Tstg Storage temperature –55 150 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 Electrostatic V(ESD) V discharge Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input operating voltage 4.5 18 V TJ Junction temperature –40 125 °C 6.4 Thermal Information TPS65251-x THERMAL METRIC(1) RHA UNIT 40 PINS RθJA Junction-to-ambient thermal resistance 32.7 RθJC(top) Junction-to-case (top) thermal resistance 21.4 RθJB Junction-to-board thermal resistance 8.3 °C/W ψJT Junction-to-top characterization parameter 0.2 ψJB Junction-to-board characterization parameter N/A RθJC(bot) Junction-to-case (bottom) thermal resistance 2 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPS65251-1 TPS65251-2 TPS65251-3 |
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