EN1

PGND2

PGND2

PVIN2

PVIN2

ADDR

MODE

V7V

VIN

PVIN1

EN2

PVIN1

FB2

VOUT2

BST2

LX2

LX2

SS2

COMP2

AGND

ROSC

COMP1

SS1

LX1

PGND1

PGND1

LX1

BST1

1

2

3

5

6

7

8

9

10

11

12

13

14

28

29

30

31

32

21

22

23

24

25

26

27

19

20

L1

4.7uH

C19

47nF

VOUT 1=0.68V~1.95V

Res . = 10mV

Max. Io1=6A

Power Ground

Analog Ground

C22

C9

1uF

R16

10K

R15

10K

C14

10uF

DVCC

SCL

SDA

R23

C23

VIN

4.5V~18V

VOUT1

FB1

17

18

SDA

SCL

15

16

Power Pad

4

C20

5x22uF

R17

R18

C18

C3

10uF

R2

100K

R1

100K

L2

4. 7uH

C30

47nF

VOUT 2=0.68V~1.95V

Res . = 10mV

Max. Io1=3.5A

C27

C29

5x22uF

R32

R31

C31

C26

R26

R24

33

TPS65276V

www.ti.com

SLVSBW0B – FEBRUARY 2013 – REVISED JANUARY 2014

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

TYPICAL APPLICATION

Figure 1. Dual Mode Operation to Deliver 6 A at Buck 1 and 3.5 A at Buck 2

Copyright © 2013–2014, Texas Instruments Incorporated

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