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KVR16R11S4-8KF Datasheet(PDF) 1 Page - List of Unclassifed Manufacturers

Part # KVR16R11S4-8KF
Description  8GB 1Rx4 1G x 72-Bit PC3-12800
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KVR16R11S4/8KF
8GB 1Rx4 1G x 72-Bit PC3-12800
CL11 Registered w/Parity 240-Pin DIMM
DESCRIPTION
This document describes ValueRAM's 1G x 72-bit (8GB) DDR3-
1600 CL11 SDRAM (Synchronous DRAM), registered w/parity,
1Rx4 ECC memory module, based on eighteen 1G x 4-bit
FBGA components. The SPD is programmed to JEDEC stan-
dard latency DDR3-1600 timing of 11-11-11 at 1.5V. This 240-
pin DIMM uses gold contact fingers. The electrical and me-
chanical specifications are as follows:
FEATURES
JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
VDDQ = 1.5V (1.425V ~ 1.575V)
800MHz fCK for 1600Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 11, 10, 9, 8, 7, 6
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
On-DIMM thermal sensor (Grade B)
Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
PCB : Height 1.180” (30.00mm), double sided component
Document No. VALUERAM1372-001.A00
11/11/13
Page 1
Memory Module Specifications
SPECIFICATIONS
CL(IDD)
11 cycles
Row Cycle Time (tRCmin)
48.125ns (min.)
Refresh to Active/Refresh
260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin)
35ns (min.)
Maximum Operating Power
TBD W*
UL Rating
94 V - 0
Operating Temperature
0o C to 85o C
Storage Temperature
-55o C to +100o C
*Power will vary depending on the SDRAM and
Register/PLL used.
Continued >>
SDRAM SUPPORTED
Kingston (F-Die)


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