NB3H63143G

www.onsemi.com

7

Output Enable/Disable

Output Enable pins (OE[2:0]) are LVCMOS/LVTTL

input pins that individually enable or disable the outputs

CLK[2:0] respectively. These inputs only disable the output

buffers thus not affecting the rest of the blocks on the device.

When using a differential output, only the OE1 pin must be

used to enable/disable the differential output (the OE0 pin

will be ignored). The hardware OE pins have an effect only

when the respective outputs are enabled in the configuration

space. The output disable state can be set to high impedance

(Hi−Z) or Low.

Power Down

Power saving mode can be activated though the power

down PD# input pin. This input is an LVCMOS/LVTTL

active Low Master Reset that disables the device and sets the

outputs Low. By default it has an internal pull−down resistor.

The device functions are disabled by default and when the

PD# pin is pulled high the device functions are activated.

Default Device State

The

NB3H63143G

parts

shipped

from

ON Semiconductor are blank, with no inputs/outputs

programmed. The parts need to be programmed by the field

sales or by a distributor or by the users themselves before

they

can

be

used.

Programmable

clock

software

downloadable from the ON Semiconductor website can be

used along with the programming kit to achieve this

purpose. For mass production, parts can be factory

programmed with a customer qualified configuration and

sourced from ON Semiconductor as a dash part number (Eg.

NB3H63143G−01).

Table 7. ATTRIBUTES

Characteristic

Value

ESD Protection − Human Body Model

2 kV

Internal Input Default State Pull Up/Down Resistor

50 k

W

Moisture Sensitivity, Indefinite Time Out of Dry Pack

(Note 1)

MSL1

Flammability Rating − Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125in

Transistor Count

130k

Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

Symbol

Parameter

Rating

Unit

VDD

Positive Power Supply with Respect to Ground

−0.5 to +4.6

V

Input Voltage with Respect to Chip Ground

−0.5 to VDD + 0.5

V

Operating Ambient Temperature Range (Industrial Grade)

−40 to +85

°C

Storage Temperature

−65 to +150

°C

Max. Soldering Temperature (10 sec)

265

°C

Thermal Resistance (Junction−to−Ambient) (Note 3)

0 lfpm

500 lfpm

32.3

24.22

°C/W

°C/W

Thermal Resistance (Junction−to−Case)

3.6

°C/W

Junction Temperature

125

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

2. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and not valid simultaneously.

If stress limits are exceeded device functional operation is not implied, damage may occur and reliability may be affected.

3. JEDEC standard multilayer board − 2S2P (2 signal, 2 power). JESD51.7 type board. Back side Copper heat spreader area 100 sqmm, 2 oz

(0.070mm) copper thichness.