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NCP436FCT2G Datasheet(PDF) 6 Page - ON Semiconductor |
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NCP436FCT2G Datasheet(HTML) 6 Page - ON Semiconductor |
6 / 7 page NCP436, NCP437 http://onsemi.com 6 APPLICATION INFORMATION Power Dissipation Main contributor in term of junction temperature is the power dissipation of the power MOSFET. Assuming this, the power dissipation and the junction temperature in normal mode can be calculated with the following equations: P D + RDS(on) I OUT 2 PD = Power dissipation (W) RDS(on) = Power MOSFET on resistance ( W) IOUT = Output current (A) T J + RD RqJA ) TA TJ = Junction temperature ( °C) RqJA = Package thermal resistance ( °C/W) TA = Ambient temperature ( °C) PCB Recommendations The NCP437 integrates an up to 3 A rated PMOS FET, and the PCB design rules must be respected to properly evacuate the heat out of the silicon. By increasing PCB area, especially around IN and OUT pins, the RqJA of the package can be decreased, allowing higher power dissipation. Routing example: 2 oz, 4 layers with vias across two internal inners. Figure 4. Example of application definition. T J * TA + R qJA P D + R qJA R DS(on) I2 TJ: Junction Temperature. TA: Ambient Temperature. Rq = Thermal resistance between IC and air, through PCB. RDS(on): Intrinsic resistance of the IC MOSFET. I: Load DC current. Taking into account of Rq obtain with: • 1 oz, 2 layers: 100°C/W. At 3 A, 25 °C ambient temperature, RDS(on 20 mW @ VIN 5 V, the junction temperature will be: T J + R qJA P D + 25 ) 0.02 32 100 + 43° C Taking into account of Rq obtain with: • 2 oz, 4 layers: 60°C/W. At 3 A, 65 °C ambient temperature, RDS(on) 24 mW @ VIN 5 V, the junction temperature will be: T J + TA ) R q P D + 65 ) 0.024 32 60 + 78° C ORDERING INFORMATION Device Marking Option Package Shipping† NCP437FCT2G AR Auto discharge WLCSP 1 x 1.5 mm (Pb−Free) 3000 / Tape & Reel NCP436FCT2G AQ Without Auto discharge WLCSP 1 x 1.5 mm (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. |
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