PCS2I2309NZ datasheet(2/6 Pages) ONSEMI

Part #	PCS2I2309NZ

Description	3.3 V 1:9 Clock Buffer

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PCS2I2309NZ

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Figure 2. Pin Configuration

1

2

3

413

14

15

16

OUTPUT8

OUTPUT7

OUTPUT9

VDD

BUF_IN

OUTPUT1

OUTPUT2

VDD

5

6

7

89

10

11

12

PCS2I2309NZ

OUTPUT6

OUTPUT5

GND

OUTPUT3

OUTPUT4

VDD

Table 1. PIN DESCRIPTION

Pin #

Pin Name

Description

4, 8, 13

VDD

3.3 V Digital Supply Voltage

5, 9, 12

GND

Ground

1

BUF_IN

Input Clock

2, 3, 6, 7, 10, 11, 14, 15, 16

OUTPUT [1:9]

Outputs

Table 2. ABSOLUTE MAXIMUM RATINGS

Parameter

Min

Max

Unit

Supply Voltage to Ground Potential

−0.5

+4.6

V

DC Input Voltage (Except REF)

−0.5

VDD + 0.5

V

DC Input Voltage (REF)

−0.5

7

V

Storage temperature

−65

+150

°C

Max. Soldering Temperature (10 sec)

260

°C

Junction Temperature

150

°C

Static Discharge Voltage (As per JEDEC STD22− A114−B)

2000

V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

Table 3. OPERATING CONDITIONS

Parameter

Description

Min

Max

Unit

VDD

Supply Voltage

3.0

3.6

V

TA

Operating Temperature

−40

+85

°C

CL

Load Capacitance, Fout < 100 MHz

30

pF

Load Capacitance, 100 MHz < Fout < 133.33 MHz

15

pF

CIN

Input Capacitance

7

pF

BUF_IN, OUTPUT [1:9]

Operating Frequency

DC

133.33

MHz

tPU

Power−up time for all VDD’s to reach minimum specified voltage

(power ramps must be monotonic)

0.05

50

mS

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