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CHFP6KE75 Datasheet(PDF) 1 Page - Microsemi Corporation |
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CHFP6KE75 Datasheet(HTML) 1 Page - Microsemi Corporation |
1 / 3 page MSC1596.PDF ISO 9001 CERTIFIED REV B 3/13/2000 8700 E. Thomas Road Scottsdale, AZ 85251 Tel: (480) 941-6300 Fax: (480) 947-1503 BIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm) FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT UNIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm) FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT FLIP-CHIP TVS DIODES CHFP6KE5.0 thru CHFP6KE170CA Patented Flip-Chip Series VBR above 30 V VBR 30V and below FEATURES • Unidirectional and Bidirectional • Fully glass passivated • 600 watt (10/1000 µs) • Eliminates wire bonding • NON Inductive Insertion • No voltage overshoot MAXIMUM RATINGS • Max Junction Temperature: 150 0C (with conformal coating) • Storage Temperature: -55 0C to +1500C • Flip-Chip Peak Pulse Power: 600 Watts (10/1000 µs) • Maximum non-repetitive peak power 600 Watts (10/1000 µs) • Total continuous power dissipation 2.5 W (with adequate heat sink @ 75 0C) • Turn-on time (theoretical) unidirectional 1X10 -12 • Turn-on time (theoretical) bidirectional 1X10 -9 MECHANICAL • Weight: 0.01 grams (approximate) • Solderable standoff tabs .040X.040X.010 PACKAGING • Waffle package 50 pices or wafer ring 70 pieces |
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