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TPS562200 Datasheet(PDF) 5 Page - Texas Instruments |
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TPS562200 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 30 page TPS562200, TPS563200 www.ti.com SLVSCB0C – JANUARY 2014 – REVISED AUGUST 2015 7 Specifications 7.1 Absolute Maximum Ratings (1) TJ = -40°C to 150°C(unless otherwise noted) MIN MAX UNIT VIN, EN –0.3 19 V VBST –0.3 25 V VBST (10 ns transient) –0.3 27.5 V Input voltage range VBST (vs SW) –0.3 6.5 V VFB –0.3 6.5 V SW –2 19 V SW (10 ns transient) –3.5 21 V Operating junction temperature, TJ –40 150 °C Storage temperature range, Tstg –55 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101, ±500 all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions TJ = -40°C to 150°C(unless otherwise noted) MIN MAX UNIT VIN Supply input voltage range 4.5 17 V VBST –0.1 23 VBST (10 ns transient) –0.1 26 VBST(vs SW) –0.1 6 VI Input voltage range EN –0.1 17 V VFB –0.1 5.5 SW –1.8 17 SW (10 ns transient) –3.5 20 TA Operating free-air temperature –40 85 °C 7.4 Thermal Information TPS562200 TPS563200 UNITS THERMAL METRIC (1) DDC (SOT) DDC (SOT) (6 PINS) (6 PINS) RθJA Junction-to-ambient thermal resistance 89.0 87.9 RθJCtop Junction-to-case (top) thermal resistance 44.5 42.2 RθJB Junction-to-board thermal resistance 3.4 13.6 °C/W ψJT Junction-to-top characterization parameter 2.2 1.9 ψJB Junction-to-board characterization parameter 13.2 13.3 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPS562200 TPS563200 |
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