TPS562200, TPS563200

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SLVSCB0C – JANUARY 2014 – REVISED AUGUST 2015

7 Specifications

7.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

VIN, EN

–0.3

19

V

VBST

–0.3

25

V

VBST (10 ns transient)

–0.3

27.5

V

Input voltage range

VBST (vs SW)

–0.3

6.5

V

VFB

–0.3

6.5

V

SW

–2

19

V

SW (10 ns transient)

–3.5

21

V

–40

150

°C

–55

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply input voltage range

4.5

17

V

VBST

–0.1

23

VBST (10 ns transient)

–0.1

26

VBST(vs SW)

–0.1

6

Input voltage range

EN

–0.1

17

V

VFB

–0.1

5.5

SW

–1.8

17

SW (10 ns transient)

–3.5

20

Operating free-air temperature

–40

85

°C

7.4 Thermal Information

TPS562200

TPS563200

UNITS

DDC (SOT)

DDC (SOT)

(6 PINS)

(6 PINS)

Junction-to-ambient thermal resistance

89.0

87.9

Junction-to-case (top) thermal resistance

44.5

42.2

Junction-to-board thermal resistance

3.4

13.6

°C/W

Junction-to-top characterization parameter

2.2

1.9

Junction-to-board characterization parameter

13.2

13.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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