ADP3209D

http://onsemi.com

2

Figure 1. Functional Block Diagram

VID

DAC

FBRTN

PWRGD

Startup

Delay

PWRGD

PWRGD

Open

Drain

+

−

+

−

+

−

+

−

CSREF

DAC + 200mV

DAC − 300mV

Soft

Transient

Delay

Delay

Disable

DAC

−

+

−

+

CSREF

CSFB

CSCOMP

ILIM

OVP

CSREF

1.7 V

+

−

+

−

Σ _

+

LLINE

REF

REF

Σ

+

+

VEA

FB

COMP

UVLO

Shutdown

and Bias

UVLO

VCC EN

GND

Oscillator

RPM RT RAMP

IMON

Current

Monitor

Current

BST

DRVH

Current

Limit

Circuit

OCP

Shutdown

Delay

SW

PGND

DRVL

PVCC

Driver

Logic

Precision

Reference

Precision

Soft−Start

VARFREQ

ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Unit

VCC

−0.3 to +6.0

V

FBRTN, PGND

−0.3 to +0.3

V

BST

DC

t < 200 ns

−0.3 to +28

−0.3 to +33

V

BST to SW

−0.3 to +6.0

V

SW

DC

t < 200 ns

−5 to +22

−10 to +28

V

DRVH to SW

DC

−0.3 to +6.0

V

DRVL to PGND

DC

t < 200 ns

−0.3 to +6.0

−0.3 to +6.0

−5.0 to +6.0

V

RAMP (in Shutdown)

−0.3 to +22

V

All Other Inputs and Outputs

−0.3 to +6.0

V

Storage Temperature

−65 to +150

°C

Operating Ambient Temperature Range

0 to 100

°C

Operating Junction Temperature

125

°C

32.6

°C/W

Lead Temperature

Soldering (10 sec)

Infrared (15 sec)

300

260

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.