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CHF15KE200 Datasheet(PDF) 1 Page - Microsemi Corporation |
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CHF15KE200 Datasheet(HTML) 1 Page - Microsemi Corporation |
1 / 3 page MSC0996.PDF ISO 9001 CERTIFIED REV F 7/20/00 8700 E. Thomas Road Scottsdale, AZ 85251 PH: (480) 941-6300 FAX: (480) 947-1503 FEATURES MAXIMUM RATINGS MECHANICAL • Unidirectional and Bidirectional • Max Junction Temperature: 1750C • Fully glass passivated • Storage Temperature: -550C to +1750C • 1500 watt (10/1000 µs) • Flip Chip Peak Pulse Power: 1500 Watts (10/1000 µs) • Eliminates wire bonding • Maximum non-repetitive peak power 1500 Watts • No overshoot (10/1000 µs) • NON Inductive Insertion • Total continuous power dissipation @ T lead = 75 0C 2.5 W • Turn-on time (theoretical) unidirectional 1X10-12 • Turn-on time (theoretical) bidirectional 1X10-9 MECHANICAL • Weight: 0.3 grams (approximate) PACKAGING • Cathode mark on top side • Waffle package • Metallization Cr - Ag – Au (Both Sides) • 50 pieces per pack (STANDARD) BIDIRECTIONAL ALL DIMENSIONS NOMINAL FLIP CHIP DIMENSIONS PAD SIZE & CIRCUIT FLIP CHIP TVS DIODES CHF1.5KE6.8 thru CHF1.5KE400CA Patented Flip Chip Series |
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