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Material Content Data Sheet

Sales Product Name

IPU60R950C6

Issued

8. October 2014

MA#

MA000986850

Package

PG-TO251-3-341

Weight*

381.53 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

2.144

0.56

0.56

5619

5619

leadframe

non noble metal

iron

7439-89-6

0.229

0.06

601

inorganic material

phosphorus

7723-14-0

0.069

0.02

180

non noble metal

copper

7440-50-8

228.946

60.02

60.10

600083

600864

wire

non noble metal

aluminium

7429-90-5

0.432

0.11

0.11

1132

1132

encapsulation

inorganic material

antimonytrioxide

1309-64-4

1.736

0.46

4550

plastics

brominated resin

-

1.860

0.49

4875

organic material

carbon black

1333-86-4

1.984

0.52

5201

plastics

epoxy resin

-

16.741

4.39

43879

inorganic material

silicondioxide

60676-86-0

101.687

26.65

32.51

266527

325032

leadfinish

non noble metal

tin

7440-31-5

3.740

0.98

0.98

9803

9803

plating

non noble metal

nickel

7440-02-0

0.509

0.13

0.13

1334

1334

solder

noble metal

silver

7440-22-4

0.056

0.01

147

non noble metal

tin

7440-31-5

0.045

0.01

118

non noble metal

lead

7439-92-1

2.144

0.56

0.58

5621

5886

heatspreader

non noble metal

iron

7439-89-6

0.019

0.00

50

inorganic material

phosphorus

7723-14-0

0.006

0.00

15

non noble metal

copper

7440-50-8

19.177

5.03

5.03

50265

50330

*deviation

< 10%

Sum in total:

100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption

7a, Lead in high melting temperature type solders.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com