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North America

Cooper Electronic Technologies

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Suite F

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Tel: 1-561-998-4100

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Europe

Cooper Electronic Technologies

Cooper (UK) Limited

Burton-on-the-Wolds

Leicestershire • LE12 5TH UK

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Cooper Electronic Technologies

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+34 937 362 813

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Fax: +65 270 4160

© 2011 Cooper Bussmann

www.cooperbussmann.com

1011

BU-SB111167

Page 4 of 4

Data Sheet: 4330

Solder Reflow Profile

t

Time 25°C to Peak

Time

25°C

Preheat

A

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

T

Taabbllee 1

1 -- S

Sttaan

nddaarrdd S

SnnP

Pb

b S

Soollddeerr ((TTcc))

Volume

Volume

Packagemm

3

mm

3

Thickness

<350

>

_350

<2.5mm

235°C

220°C

>

_2.5mm

220°C

220°C

T

Taab

bllee 2

2 -- LLeeaadd ((P

Pb

b)) FFrreeee S

Soollddeerr ((TTcc))

Volume

Volume

Volume

Packagemm

3

mm

3

mm

3

Thickness

<350

350 - 2000

>2000

<1.6mm

260°C

260°C

260°C

1.6 – 2.5mm 260°C

250°C

245°C

>2.5mm

250°C

245°C

245°C

Reference JDEC J-STD-020D

Profile Feature

Standard SnPb Solder

Lead (Pb) Free Solder

Preheat and Soak• Temperature min. (Tsmin)

100°C

150°C

• Temperature max. (Tsmax)

150°C

200°C

• Time (Tsmin to Tsmax) (ts)

60-120 Seconds

60-120 Seconds

Average ramp up rate Tsmax to Tp

3°C/ Second Max.

3°C/ Second Max.

183°C

217°C

Time at liquidous (tL)

60-150 Seconds

60-150 Seconds

Peak package body temperature (TP)*

Table 1Table 2

Time (tp)** within 5 °C of the specified classification temperature (Tc)

20 Seconds**

30 Seconds**

Average ramp-down rate (Tp to Tsmax)

6°C/ Second Max.

6°C/ Second Max.

Time 25°C to Peak Temperature6 Minutes Max.

8 Minutes Max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.