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LX1664A Datasheet(PDF) 2 Page - Microsemi Corporation |
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LX1664A Datasheet(HTML) 2 Page - Microsemi Corporation |
2 / 17 page DUAL OUTPUT PWM CONTROLLERS WITH 5-BIT DAC LX1664/64A, LX1665/65A PRODUCT DA T ABOOK 1996/1997 Copyright © 1999 Rev. 1.2 11/99 2 P RODUCTION D ATA S HEET ABSOLUTE MAXIMUM RATINGS (Note 1) Supply Voltage (V C1) .................................................................................................... 25V Supply Voltage (V CC) .................................................................................................... 15V Output Drive Peak Current Source (500ns) ............................................................... 1.5A Output Drive Peak Current Sink (500ns) ................................................................... 1.5A Input Voltage (SS, INV, V CC_CORE, CT, VID0-VID4) ........................................... -0.3V to 6V Operating Junction Temperature Plastic (N, D & DW Packages) ............................................................................. 150°C Storage Temperature Range .................................................................... -65°C to +150°C Lead Temperature (Soldering, 10 Seconds) ............................................................. 300°C PACKAGE PIN OUTS N (16-PIN DIP) PACKAGE: THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 65°C/W N (18-PIN DIP) PACKAGE: THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 60°C/W D PACKAGE: THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 120°C/W DW PACKAGE: THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 90°C/W Junction Temperature Calculation: T J = TA + (PD x θJA). The θ JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow THERMAL DATA Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of the specified terminal. Pin numbers refer to DIL packages only. V C1 TDRV GND BDRV V CC C T L DRV L FB SS INV V CC_CORE VID0 VID1 VID2 VID3 VID4 1 16 215 314 413 512 611 710 89 N PACKAGE — 16-Pin LX1664/1664A (Top View) V C1 TDRV GND BDRV V CC C T L DRV L FB SS INV V CC_CORE VID0 VID1 VID2 VID3 VID4 1 16 215 314 413 512 611 710 89 D PACKAGE — 16-Pin LX1664/1664A (Top View) V C1 TDRV GND BDRV V CC C T OV L DRV PWRGD SS INV V CC_CORE VID0 VID1 VID2 VID3 VID4 L FB 1 18 217 316 415 514 613 712 811 910 N PACKAGE — 18-Pin LX1665/1665A (Top View) V C1 TDRV GND BDRV V CC C T OV L DRV PWRGD SS INV V CC_CORE VID0 VID1 VID2 VID3 VID4 L FB 1 18 217 316 415 514 613 712 811 910 DW PACKAGE — 18-Pin LX1665/1665A (Top View) DEVICE SELECTION GUIDE OVP and Current-Sense DEVICE Packages Power Good Comp. Thresh. (mV) Optimal Load LX1664 16-pin SOIC No 100 Pentium-class (<10A) LX1664A & DIP 60 Pentium II (> 10A) LX1665 18-pin SOIC Yes 100 Pentium-class (<10A) LX1665A & DIP 60 Pentium II (> 10A) DESCRIPTION (con't.) Smallest Package Size. The LX1664 is available in a narrow body 16-pin surface mount IC package for space sensitive appli- cations. The LX1665 provides the additional functions of Over Voltage Protection (OVP) and Power Good (PWRGD) output drives for applications requiring output voltage monitoring and protection functions. Ultra-Fast Transient Response re- duces system cost. The modulated off- time architecture results in the fastest tran- sient response for a given inductor, reduc- ing output capacitor requirements, and re- ducing the total regulator system cost. Over-Voltage Protection and Power Good Flag. The OVP output in the LX1665 & LX1665A can be used to drive an SCR crowbar circuit to protect the load in the event of a short-circuit of the main MOSFET. The LX1665 & LX1665A also have a logic- level Power Good Flag to signal when the output voltage is out of specified limits. |
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