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Material Content Data Sheet

Sales Product Name

BSB012N03LX3 G

Issued

19. November 2015

MA#

MA000629688

Package

MG-WDSON-2-8

Weight*

86.37 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

6.356

7.36

7.36

73594

73594

leadframe

non noble metal

copper

7440-50-8

74.415

86.17

86.17

861570

861570

leadfinish

non noble metal

nickel

7440-02-0

0.211

0.24

2445

noble metal

silver

7440-22-4

0.840

0.97

1.21

9725

12170

plating

non noble metal

nickel

7440-02-0

0.211

0.24

0.24

2445

2445

glue

plastics

epoxy resin

-

0.254

0.29

2942

noble metal

silver

7440-22-4

1.561

1.81

2.10

18071

21013

solder

non noble metal

copper

7440-50-8

0.011

0.01

127

noble metal

silver

7440-22-4

0.066

0.08

763

non noble metal

tin

7440-31-5

2.119

2.45

2.54

24528

25418

passivation

plastics

epoxy resin

-

0.327

0.38

0.38

3790

3790

*deviation

< 10%

Sum in total:

100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com