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LX8386A-00 Datasheet(PDF) 2 Page - Microsemi Corporation |
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LX8386A-00 Datasheet(HTML) 2 Page - Microsemi Corporation |
2 / 7 page 1.5A L OW D ROPOUT P OSITIVE R EGULA TORS LX8386-xx/8386A-xx/8386B-xx PRODUCT DA T ABOOK 1996/1997 Copyright © 1999 Rev. 1.7a 10/00 2 P RODUCTION D ATA S HEET ABSOLUTE MAXIMUM RATINGS (Note 1) Power Dissipation .................................................................................. Internally Limited Input Voltage ................................................................................................................ 10V Input to Output Voltage Differential ........................................................................... 10V Maximum Output Current .......................................................................................... 1.5A Operating Junction Temperature Plastic (P, DD & DT Packages) ............................................................................ 150°C Storage Temperature Range ...................................................................... -65°C to 150°C Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C PACKAGE PIN OUTS P PACKAGE (Top View) * Pin 1 is GND for fixed voltage versions. DD PACKAGE (Top View) * Pin 1 is GND for fixed voltage versions. Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of the specified terminal. P PACKAGE: THERMAL RESISTANCE-JUNCTION TO TAB, θθθθθ JT 3.0°C/W THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 60°C/W DD PACKAGE: THERMAL RESISTANCE-JUNCTION TO TAB, θθθθθ JT 3.0°C/W THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA *60°C/W DT PACKAGE: THERMAL RESISTANCE-JUNCTION TO TAB, θθθθθ JT 9°C/W THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA *80°C/W Junction Temperature Calculation: T J = TA + (PD x θJA). The θ JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. * θ JAcan be improved with package soldered to 0.5IN 2 copper area over backside ground plane or internal power plane. θ JAcan vary from 20ºC/W to > 40ºC/W depending on mounting technique. THERMAL DATA BLOCK DIAGRAM Thermal Limit Circuit Control Circuit Bandgap Circuit Output Circuit Bias Circuit V OUT V IN SOA Protection Circuit Current Limit Circuit ADJ or GND* 3 2 1 3 2 1 TAB IS V OUT TAB IS V OUT * This pin GND for fixed voltage versions. 3. V IN 2. V OUT 1. ADJ / GND* DT PACKAGE (D-Pak) (Top View) * Pin 1 is GND for fixed voltage versions. TAB IS V OUT V IN V OUT ADJ / GND* V IN V OUT ADJ / GND* |
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