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LX8630-33CP Datasheet(PDF) 2 Page - Microsemi Corporation |
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LX8630-33CP Datasheet(HTML) 2 Page - Microsemi Corporation |
2 / 9 page Microsemi Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 Copyright © 2000 Rev. 1.0a,2000-11-28 LX8630-xx 3A BiCMOS Very Low Dropout Regulators PRODUCTION DATA SHEET A M I CROS E M I COM P A N Y P PLASTIC TO-220 3-PIN THERMAL RESISTANCE -JUNCTION TO TAB , θ JT 2.1 °C/W THERMAL RESISTANCE -JUNCTION TO AMBIENT, θ JA 60 °C/W P PLASTIC TO-220 5-PIN THERMAL RESISTANCE -JUNCTION TO TAB, θ JT 2.1 °C/W THERMAL RESISTANCE -JUNCTION TO AMBIENT, θ JA 60 °C/W DD PLASTIC TO-263 3-PIN THERMAL RESISTANCE -JUNCTION TO TAB, θ JT 2.1 °C/W THERMAL RESISTANCE -JUNCTION TO AMBIENT, θ JA 60 °C/W DD PLASTIC TO-263 5-PIN THERMAL RESISTANCE -JUNCTION TO TAB, θ JT 2.1 °C/W THERMAL RESISTANCE -JUNCTION TO AMBIENT, θ JA 60 °C/W Junction Temperature Calculation: TJ = TA + (PD x θJA). The θ JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. • θ JA can be improved with package soldered to 0.5IN 2 copper area over backside ground plane or internal power plane . θ JA can vary from 20°C/W to > 40°C/W depending on mounting technique. See table below for thermal resistance guidelines: Copper Area (Topside)* Copper Area (Backside)* Board Area Thermal Resistance ( θ JA) 2.5 sq” (1613mm 2) 2.5 sq” (1613mm 2) 2.5 sq” (1613mm 2) 25°C/W 1.0 sq” (645 mm 2) 2.5 sq” (1613mm 2) 2.5 sq” (1613mm 2) 27°C/W 0.17 sq” (110 mm 2) 2.5 sq” (1613mm 2) 2.5 sq” (1613mm 2) 35°C/W *Tab of device attached to topside copper DD PACKAGE (3-PIN) (Top View) 1 V IN GND V OUT 2 3 TAB is GND DD PACKAGE (5-PIN) (T op V iew) 1 V IN GN D V OU T 2 3 T AB is G N D 4 5 ADJ SHDN P PACK AG E (5-PIN ) (Top V iew) 1 2 3 TA B is G N D 4 5 GN D V OU T AD J S HDN V IN P PACKAGE (3-PIN) (Top View) 1 2 3 TAB is GND GND V OUT V IN Input Voltage (VIN) ......................................................................................................6.5V SHDN Pin..............................................................................................-0.3V to VIN +0.3V Operating Junction Temperature Plastic (P & DD Packages) ................................................................................... 150 °C Storage Temperature Range ........................................................................-65 °C to 150°C Lead Temperature (Soldering, 10 seconds) ............................................................... 300 °C Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal. |
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