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LX8587A-15CDD Datasheet(PDF) 2 Page - Microsemi Corporation |
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LX8587A-15CDD Datasheet(HTML) 2 Page - Microsemi Corporation |
2 / 8 page 3A L OW D ROPOUT P OSITIVE R EGULATORS LX8587-xx/8587A-xx PRODUCT DA T ABOOK 1996/1997 Copyright © 1998 Rev. 1.2 3/98 2 P RODUCTION D ATA S HEET ABSOLUTE MAXIMUM RATINGS (Note 1) Power Dissipation ................................................................................ Internally Limited Input Voltage ............................................................................................................... 10V Input to Output Voltage Differential .......................................................................... 10V Maximum Output Current ............................................................................................. 5A Operating Junction Temperature Plastic (P Package) ............................................................................................... 150°C Storage Temperature Range ...................................................................... -65°C to 150°C Lead Temperature (Soldering, 10 seconds) ............................................................ 300°C PACKAGE PIN OUTS P PACKAGE (Top View) * Pin 1 is GND for fixed voltage versions. Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of the specified terminal. V IN V OUT ADJ / GND* 3 2 1 P PACKAGE: THERMAL RESISTANCE-JUNCTION TO TAB, θθθθθ JT 3.0°C/W THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 60°C/W DD PACKAGE: THERMAL RESISTANCE-JUNCTION TO TAB, θθθθθ JT 3.0°C/W THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 60°C/W* Junction Temperature Calculation: T J = T A + (P D x θ JA ). The θ JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. * With package soldered to 0.5 in.2 copper area over back-side ground plane or internal power plane, θ JA can vary from 20°C/W to 40°C/W, depending on mounting technique. THERMAL DATA 3 2 1 V IN ADJ / GND* V OUT DD PACKAGE (Top View) * Pin 1 is GND for fixed voltage versions. TAB IS V OUT TAB IS V OUT |
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