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THS4532 Datasheet(PDF) 5 Page - Texas Instruments |
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THS4532 Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 58 page  THS4532 www.ti.com SLOS829A – FEBRUARY 2013 – REVISED JULY 2015 7 Specifications 7.1 Absolute Maximum Ratings (1) MIN MAX UNIT Supply voltage, VS– to VS+ 5.5 V Input/output voltage, VIN±, VOUT±, and VOCM pins (VS–) – 0.7 (VS+) + 0.7 V Differential input voltage, VID 1 V Continuous output current, IO 50 mA Continuous input current, Ii 0.75 mA Continuous power dissipation See Thermal Information Maximum junction temperature, TJ 150 °C Operating junction temperature, TJ –40 125 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VS+ Single-supply voltage 2.7 5 5.4 V TA Ambient temperature –40 25 125 °C 7.4 Thermal Information THS4532 THERMAL METRIC (1) TSSOP (PW) UNIT 16 PINS RθJA Junction-to-ambient thermal resistance 122.4 RθJC(top) Junction-to-case (top) thermal resistance 61.2 RθJB Junction-to-board thermal resistance 66.7 °C/W ψJT Junction-to-top characterization parameter 14.4 ψJB Junction-to-board characterization parameter 66.2 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2013–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: THS4532 |
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