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MWS11-2 Datasheet(PDF) 2 Page - Microsemi Corporation

Part # MWS11-2
Description  CMDA Power Amplifier
Download  5 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

MWS11-2 Datasheet(HTML) 2 Page - Microsemi Corporation

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PRELIMINARY
Microsemi
Micro WaveSys
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
© 2000
Rev. 0.2,2000-12-08
MWS11-PH22-CS
CMDA Power Amplifier
A
M I CROSEM I
COM P A N Y
  
   

   
   
  
      
      
  
 
  
RF IN
RF input. An external series capacitor is required as a DC block. The input match can be improved to < 2:1 by
using a series capacitor and shunt inductor.
VCC1
Power supply for first stage and interstage match. VCC should be fed through an inductor terminated with a
capacitor on the supply side.
VCC2
Power supply for Second stage and interstage match. VCC should be fed through an inductor terminated with a
capacitor on the supply side.
VCC
Supply for bias reference circuits.
VB1
First stage control voltage. The VB1 pin can be connected with the other stage control voltages into a single
reference voltage through an external resistor bridge.
VB2
Second stage control voltage. The VB2 pin can be connected with the other stage control voltages into a single
reference voltage through an external resistor bridge.
RF OUT
RF Output and Power supply for final stage. This is the unmatched collector output of the third stage. A DC
Block is required following the matching components. The biasing may be provided via a parallel L-C set for
resonance at the operating frequency of 1920MHz to 1980 MHz. It is important to select an inductor with very
low DC resistance with a 1A current rating. Alternatively, shunt microstrip techniques are also applicable and
provide very low DC resistance. Low frequency bypassing is required for stability. There are three pins
designated as RF OUT.
GND
This is a bias circuit level ground, isolated from the backside ground contact.
GND1
Ground for First Stage. This ground should be isolated from the backside ground contact.
GND2
Ground for Second Stage. This ground should be isolated from the backside ground contact.
PKG GND
Ground connection. The backside of the package should be soldered to a top side ground pad which is
connected to the ground plane with multiple vias. The pad should have a short thermal path to the ground plane.
Supply Voltage (VBAT) ........................................................................................... +8.0VDC
Supply Voltage (POUT < 31 dBm) ........................................................................... +4.5VDC
Control Voltage (VREF)........................................................................................... +3.2VDC
Input RF Power ........................................................................................................ +6dBm
Operating Case Temperature....................................................................... -30°C to 100°C
Storage Temperature ................................................................................... -65°C to 150°C
Note:
Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.


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