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NB3N51032DTR2G Datasheet(PDF) 4 Page - ON Semiconductor

Part # NB3N51032DTR2G
Description  Dual HCSL/LVDS Clock Generator
Download  13 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NB3N51032DTR2G Datasheet(HTML) 4 Page - ON Semiconductor

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NB3N51032
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4
Table 5. MAXIMUM RATINGS (Note 2)
Symbol
Parameter
Rating
Unit
VDD
Positive Power Supply with respect to GND (VDDXD and VDDODA)
4.6
V
VI
Input Voltage with respect to GND (VIN)
−0.5 V to VDD+0.5 V
V
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient) (Note 3)
0 lfpm
500 lfpm
74
64
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
50
°C/W
Tsol
Wave Solder
265
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
2. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and not valid simultaneously. If
stress limits are exceeded device functional operation is not implied, damage may occur and reliability may be affected.
3. JEDEC standard multilayer board − 2S2P (2 signal, 2 power).
Table 6. DC CHARACTERISTICS (VDD = 3.3 V ±5%, GND = 0 V, TA = −40°C to +85°C, Note 4)
Symbol
Characteristic
Min
Typ
Max
Unit
VDD
Power Supply Voltage (VDDXD and VDDODA)
3.135
3.3
3.465
V
GND
Power Supply Ground (GNDXD and GNDODA)
0
V
IDD
Power Supply Current, 200 MHz Output, −0.75% spread
100
mA
IDDOE
Power Supply Current when OE is Set Low
55
mA
VIH
Input HIGH Voltage (X1/CLK, S0, S1, SS0, SS1 and OE)
2000
VDD + 300
mV
VIL
Input LOW Voltage (X1/CLK, S0, S1, SS0, SS1 and OE)
GND − 300
800
mV
VOH
Output HIGH Voltage for HCSL Output (Note 5)
660
850
mV
VOL
Output LOW Voltage for HCSL Output (Note 5)
−150
0
mV
Vcross
Crossing Voltage Magnitude (Absolute) for HCSL Output (Notes 6 and 7)
250
550
mV
DVcross
Change in Magnitude of Vcross for HCSL Output (Notes 6 and 8)
150
mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
4. VDDXD and VDDODA power pins must be shorted to power supply voltage VDD and GNDXD and GNDODA ground pins must be shorted
to power supply ground GND. Measurement taken with outputs terminated with RS = 33.2 W, RL = 49.9 W, with test load capacitance of 2
pF and current biasing resistor set at 475
W. See Figure 9. Guaranteed by characterization.
5. Measurement taken from single−ended waveform.
6. Measured at crossing point where the instantaneous voltage value of the rising edge of CLKx+ equals the falling edge of CLKx−.
7. Refers to the total variation from the lowest crossing point to the highest, regardless of which edge is crossing. Refers to all crossing points
for this measurement.
8. Defined as the total variation of all crossing voltage of rising CLKx+ and falling CLKx−. This is maximum allowed variance in the VCROSS
for any particular system.


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