NCP6335

http://onsemi.com

4

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Analog and power pins: AVIN, PVIN, SW, PG, INTB, FB

−0.3 to + 6.0

V

Digital pins: SCL, SDA, EN, VSEL, Pin:

Input Voltage

Input Current

10

V

mA

Human Body Model (HBM) ESD Rating are (Note 1)

ESD HBM

2500

V

Charged Device Model (CDM) ESD Rating are (Note 1)

ESD CDM

1250

V

Latch Up Current: (Note 2)

Digital Pins

All Other Pins

±10

±100

mA

Storage Temperature Range

−65 to + 150

°C

Maximum Junction Temperature

−40 to +150

°C

Moisture Sensitivity (Note 3)

MSL

Level 1

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. This device series contains ESD protection and passes the following tests:Human Body Model (HBM)

±2.5 kV per JEDEC standard:

JESD22−A114, Charged Device Model (CDM)

±1.25 kV per JEDEC standard: JESD22−C101 Class IV.

2. Latch up Current per JEDEC standard: JESD78 class II.

3. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Power Supply

2.3

5.5

V

Ambient Temperature Range

−40

25

+85

°C

Junction Temperature Range (Note 5)

−40

25

+125

°C

Thermal Resistance Junction to Ambient (Note 6)

CSP−20 on Demo−board

−

55

−

°C/W

Power Dissipation Rating (Note 7)

−

727

−

mW

Power Dissipation Rating (Note 7)

−

1090

−

mW

L

Inductor for DCDC converter (Note 4)

−

0.47

−

mH

Co

Output Capacitor for DCDC Converter (Note 4)

30

−

150

mF

Cin

Input Capacitor for DCDC Converter (Note 4)

4.7

−

−

mF

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

4. Including de−ratings (Refer to the Application Information section of this document for further details)

5. The thermal shutdown set to 150

°C (typical) avoids potential irreversible damage on the device due to power dissipation.

1−once internal power and ground planes and 2−once copper traces on top and bottom of the board.

125

* T

A

P

D