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NCP6335 Datasheet(PDF) 4 Page - ON Semiconductor |
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NCP6335 Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 30 page NCP6335 http://onsemi.com 4 MAXIMUM RATINGS Rating Symbol Value Unit Analog and power pins: AVIN, PVIN, SW, PG, INTB, FB VA −0.3 to + 6.0 V Digital pins: SCL, SDA, EN, VSEL, Pin: Input Voltage Input Current VDG IDG −0.3 to VA +0.3 ≤ 6.0 10 V mA Human Body Model (HBM) ESD Rating are (Note 1) ESD HBM 2500 V Charged Device Model (CDM) ESD Rating are (Note 1) ESD CDM 1250 V Latch Up Current: (Note 2) Digital Pins All Other Pins ILU ±10 ±100 mA Storage Temperature Range TSTG −65 to + 150 °C Maximum Junction Temperature TJMAX −40 to +150 °C Moisture Sensitivity (Note 3) MSL Level 1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This device series contains ESD protection and passes the following tests:Human Body Model (HBM) ±2.5 kV per JEDEC standard: JESD22−A114, Charged Device Model (CDM) ±1.25 kV per JEDEC standard: JESD22−C101 Class IV. 2. Latch up Current per JEDEC standard: JESD78 class II. 3. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A. OPERATING CONDITIONS (Note 4) Symbol Parameter Conditions Min Typ Max Unit AVIN, PVIN Power Supply 2.3 5.5 V TA Ambient Temperature Range −40 25 +85 °C TJ Junction Temperature Range (Note 5) −40 25 +125 °C RqJA Thermal Resistance Junction to Ambient (Note 6) CSP−20 on Demo−board − 55 − °C/W PD Power Dissipation Rating (Note 7) TA ≤ 85°C − 727 − mW PD Power Dissipation Rating (Note 7) TA = 65°C − 1090 − mW L Inductor for DCDC converter (Note 4) − 0.47 − mH Co Output Capacitor for DCDC Converter (Note 4) 30 − 150 mF Cin Input Capacitor for DCDC Converter (Note 4) 4.7 − − mF Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 4. Including de−ratings (Refer to the Application Information section of this document for further details) 5. The thermal shutdown set to 150 °C (typical) avoids potential irreversible damage on the device due to power dissipation. 6. The RqJA is dependent of the PCB heat dissipation. Board used to drive this data was a NCP6335EVB board. It is a multilayer board with 1−once internal power and ground planes and 2−once copper traces on top and bottom of the board. 7. The maximum power dissipation (PD) is dependent by input voltage, maximum output current and external components selected. RqJA + 125 * T A P D |
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