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SG120-5.2T Datasheet(PDF) 2 Page - Microsemi Corporation |
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SG120-5.2T Datasheet(HTML) 2 Page - Microsemi Corporation |
2 / 8 page SG120 11/91 Rev 1.4 6/97 LINFINITY Microelectronics Inc. Copyright 1997 11861 Western Avenue ∞ ∞ ∞ ∞ ∞ Garden Grove, CA 92841 2 (714) 898-8121 ∞ ∞ ∞ ∞ ∞ FAX: (714) 893-2570 ABSOLUTE MAXIMUM RATINGS (Note 1) NEGATIVE REGULATOR -65 °C to 150°C 300 °C Operating Junction Temperature Hermetic (K, R, IG - Packages) ................................... Storage Temperature Range ........................... Lead Temperature (Soldering, 10 Seconds) ................. FIGURE 1. MAXIMUM AVERAGE POWER DISSIPATION FIGURE 2. QUIESCENT CURRENT VS. LOAD FIGURE 3. TEMPERATURE COEFFICIENT Device Input Voltage Differential Output Voltage Input Voltage (Output shorted to ground) -5V -35V 35V -5.2V -35V 35V -8V -35V 35V -12V -35V 35V -15V -40V 35V -18V -40V 35V -20V -40V 35V 150 °C Note 1. Values beyond which damage may occur. Operating Junction Temperature Range: SG120 ........................................................... RECOMMENDED OPERATING CONDITIONS (Note 2) CHARACTERISTIC CURVES -55 °C to 150°C Note 2. Range over which the device is functional. THERMAL DATA K Package: Thermal Resistance-Junction to Case, θ JC ................. 3.0°C/W Thermal Resistance-Junction to Ambient, θ JA ............... 35°C/W R Package: Thermal Resistance-Junction to Case, θ JC ................. 5.0°C/W Thermal Resistance-Junction to Ambient, θ JA .............. 40°C/W T Package: Thermal Resistance-Junction to Case, θ JC .................. 15°C/W Thermal Resistance-Junction to Ambient, θ JA ............ 120°C/W IG Package: Thermal Resistance-Junction to Case, θ JC ................. 3.5°C/W Thermal Resistance-Junction to Ambient, θ JA .............. 42°C/W L Package: Thermal Resistance-Junction to Case, θ JC .................. 35°C/W Thermal Resistance-Junction to Ambient, θ JA ............ 120°C/W Note A. Junction Temperature Calculation: T J = TA + (PD x θJA). Note B. The above numbers for θ JC are maximums for the limiting thermal resistance of the package in a standard mounting configuration. The θ JA numbers are meant to be guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. |
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