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ESD7C5.0DT5G Datasheet(PDF) 1 Page - ON Semiconductor

Part # ESD7C5.0DT5G
Description  Transient Voltage Suppressors
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

ESD7C5.0DT5G Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2012
March, 2012 − Rev. 3
1
Publication Order Number:
ESD7C3.3D/D
ESD7C, SZESD7C SERIES
Transient Voltage
Suppressors
Micro−Packaged Diodes for ESD Protection
The ESD7CxxD Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage, and
fast response time make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its small size, it is suited
for use in cellular phones, portable devices, digital cameras, power
supplies and many other portable applications.
Specification Features:
Low Capacitance 6.2 pF to 13 pF
Low Clamping Voltage
Small Body Outline Dimensions:
0.047
″ x 0.047″ (1.20 mm x 1.20 mm)
Low Body Height: 0.020″ (0.5 mm)
Stand−off Voltage: 3.3 V, 5 V
Low Leakage
Response Time < 1 ns
ESD Rating of Class 3 (> 16 kV) per Human Body Model
IEC61000−4−2 Level 4 ESD Protection
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These are Pb−Free Devices
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH:
100% Matte Sn (Tin)
MOUNTING POSITION:
Any
QUALIFIED MAX REFLOW TEMPERATURE:
260
°C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 61000−4−2 (ESD)
Contact
Air
±8.0
±15
kV
Total Power Dissipation on FR−5 Board
(Note 1) @ TA = 25°C
Derate above 25°C
Thermal Resistance Junction−to−Ambient
PD
RqJA
240
1.9
525
mW
mW/°C
°C/W
Junction and Storage Temperature Range
TJ, Tstg
−55 to
+150
°C
Lead Solder Temperature − Maximum
(10 Second Duration)
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
1
3
2
PIN 1. CATHODE
2. CATHODE
3. ANODE
Device
Package
Shipping
ORDERING INFORMATION
ESD7CxxDT5G
SOT−723
(Pb−Free)
8000 /
Tape & Reel
MARKING
DIAGRAM
http://onsemi.com
SOT−723
CASE 631AA
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
L5
= Specific Device Code
M
= Date Code
L5 M
1
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
DEVICE MARKING INFORMATION
*Date Code orientation and/or position may
vary depending upon manufacturing location.
SZESD7CxxDT5G
SOT−723
(Pb−Free)
8000 /
Tape & Reel


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