ESD7451 datasheet(1/5 Pages) ONSEMI

Part #	ESD7451

Description	ESD Protection Diodes

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Manufacturer	ONSEMI [ON Semiconductor]

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June, 2014 − Rev. 2

1

Publication Order Number:

ESD7451/D

ESD7451, SZESD7451

ESD Protection Diodes

Micro−Packaged Diodes for ESD Protection

The ESD7451 is designed to protect voltage sensitive components

that require ultra−low capacitance from ESD and transient voltage

events. Excellent clamping capability, low capacitance, low leakage,

and fast response time, make these parts ideal for ESD protection on

designs where board space is at a premium. Because of its low

capacitance, the part is well suited for use in high frequency designs

such as USB 2.0 high speed and antenna line applications.

Features

• Ultra−Low Capacitance (0.35 pF Max)

• Low Clamping Voltage

• Stand−off Voltage: 3.3 V

• Low Leakage

• Response Time is < 1 ns

• Low Dynamic Resistance < 1 W

• IEC61000−4−2 Level 4 ESD Protection

• SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Typical Applications

• RF Signal ESD Protection

• RF Switching, PA, and Antenna ESD Protection

• Near Field Communications

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

IEC 61000−4−2 (ESD)

Contact

Air

±25

kV

Total Power Dissipation on FR−5 Board

(Note 1) @ TA = 25°C

Thermal Resistance, Junction−to−Ambient

°PD°

RqJA

250

400

mW

°C/W

Junction and Storage Temperature Range

TJ, Tstg

−55 to +150

°C

Lead Solder Temperature − Maximum

(10 Second Duration)

TL

260

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. FR−5 = 1.0 x 0.75 x 0.62 in.

See Application Note AND8308/D for further description of survivability specs.

Device

Package

Shipping†

ORDERING INFORMATION

http://onsemi.com

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

ESD7451N2T5G

XDFN2

(Pb−Free)

8000 / Tape &

Reel

MARKING

DIAGRAM

1

Cathode

2

Anode

E

= Specific Device Code

M

= Date Code

XDFN2

CASE 711AM

E M

G

SZESD7451N2T5G

XDFN2

(Pb−Free)

8000 / Tape &

Reel

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